Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Hiroki Ikeuchi

Satoshi Maeshima

Yui Saitou

Kaori Toyoda

Tomonori Itoh

Hiroyuki Sakamoto

Masanori Minamio

Takeshi Kawabata

Yusuke Hashimoto

Tatsuo Sasaoka

Yoshinari Matsuyama

Hiroshi Nasu

Yuzuka Isobe

Kentaro Nishiwaki

Hidekazu Araki

Yu Kaneda

Grip for robot hand

Thermoelectric conversion module

The semiconductor apparatus includes: the first lead frame; the second lead frame; the second insulation resin which is disposed between the first lead frame and the second lead frame; the sealing resin which seals the semiconductor elements, the first lead frame and the second lead frame; the electric wiring part which electrically connects the semiconductor elements and the first lead frame; and the interlayer connecting part which electrically connects the first lead frame and the second lead frame.

Semiconductor apparatus

A semiconductor device is a resin package structure including a semiconductor element Tmolded with a first resin. The first resincontains a fillerincluding an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the fillerachieves a structure with satisfactory heat dissipation and a high withstand voltage.

Electrical component resin, semiconductor device, and substrate

A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structureincludes a substratehaving electrodesand, an electronic componenthaving electrodesand, jointsandthat electrically connect the electrodesandof the substrateand the electrodesandof the electronic componentand also fix the electronic componentto the surface of the substrate, and a convex portionthat abuts against the electrodeof the substrateand the electrodeof the electronic componentand is used as a spacer.

Mounting structure, and method of manufacturing mounting structure

A manufacturing method of white-light emitting elements that is one example of the present invention is a manufacturing method of a white-light emitting element with the light emitting diode chip covered with the fluorescent-body-containing resin member that has been formed with the fluorescent-body-containing resin material containing a resin and fluorescent bodies, and includes: an irradiating step of irradiating the fluorescent-body-containing resin material with the blue laser beam; a measuring step of measuring the fluorescence strength of the fluorescence light emission from the fluorescent bodies that have been excited by the blue laser beam with which the irradiation has been carried out; and an applying step of applying, to the light emitting diode chip, a quantity of the fluorescent-body-containing resin material, the quantity being based on the fluorescence strength that has been measured.

Manufacturing method of light emitting elements, and manufacturing apparatus of light emitting elements

When bump electrodesof a semiconductor light-emitting elementand electrode portionsof a mounting boardare joined to each other, power is supplied to the electrode portionsof the mounting boardto allow the semiconductor light-emitting elementto emit light, the optical properties of the semiconductor light-emitting elementhaving emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodesof the semiconductor light-emitting elementand the electrode portionsof the mounting board, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.

Apparatus and method for mounting semiconductor light-emitting element

Growing community of inventors

Osaka, Japan

Hiroki Ikeuchi