Tdk Corporation

Fujitsu Optical Components Limited

Kabushiki Kaisha Toshiba

Hiroki Hara

Shinji Iwatsuka

Takashi Kikukawa

Masaharu Doi

Yoshinobu Kubota

Masashi Gotoh

Kenji Endou

Yasuhiro Ohmori

Shintaro Takeuchi

Toshinori Matsuura

Kenji Nagase

Hiroshi Take

Hiroshi Yamamoto

Masahiro Shinkai

Hajime Kuwajima

Takehito Tanaka

Jitsuo Kanazawa

Anthony Reymund Melad Binarao

Cheng Bu Heng

Hideaki Fukuzawa

Kenji Sasaki

Kenichi Kawabata

Hiroyuki Kaneko

Shuichi Takizawa

Motohiro Nakahara

Koichi Arishima

Yoshihiko Yoshida

Shigeru Asami

Atsushi Shimura

Seiichi Tajima

Masami Sasaki

Miyako Miyoshi

Masumi Kameda

Yumi Hanashima

Ryohei Fukuzaki

Shuntaro Kodama

Shuji Tachi

Tetsuo Miya

An optical modulation element is provided with a substrate, a waveguide layer formed on the substrate, a dielectric layer formed on the waveguide layer, and an electrode formed on the dielectric layer. An outer peripheral end portion of the dielectric layer has an offset area positioned inside an outer peripheral end portion of the substrate. In at least a part of the offset area, a distance from the outer peripheral end portion of the substrate to the outer peripheral end portion of the dielectric layer is equal to or less than a distance from the outer peripheral end portion of the substrate to the outer peripheral end portion of the electrode.

Optical modulation element

An optical modulator includes a plurality of optical modulation units having a Mach-Zehnder type optical waveguide consisting of two optical waveguides and a high-frequency line pair arranged along the two optical waveguides and consisting of two signal electrodes for applying a pair of differential high-frequency signals, and a plurality of high-resistance conductive films are provided between adjacent high-frequency line pairs separated from the high-frequency line pair.

Optical modulator

An optical circuit element capable of preventing stray light propagated through a part including a substrate of the optical circuit element from being emitted to the outside is provided. The optical circuit element has a substrate, an optical waveguide layer that is formed on one surface of the substrate, and a protective layer that is overlaid on the optical waveguide layer. The optical waveguide layer has an optical waveguide configured for light to be propagated therethrough. A groove portion, which reaches to a position deeper than the one surface from a surface of the protective layer toward the substrate, is formed. The optical circuit element further includes a light absorption layer that covers at least a bottom surface and a side surface of the groove portion.

Optical circuit element

A transmission device of the present disclosure is a transmission device that transmits a visible light signal to a receiving device, and includes a laser light source configured to emit visible light, and an optical modulator configured to change intensity of the visible light and generate a visible light signal, in which the optical modulator has an optical waveguide that serves as a transmission path for the visible light, and the optical waveguide is formed of a material containing lithium niobate.

Transmission device, information terminal, communication system, and communication method

To provide an optical modulation element capable of suppressing electrode loss at a low frequency of 50 GHz or less, and suppressing radiation loss at a high frequency of 50 GHz or more. An optical modulation element comprises: a substrate; and at least one interaction part provided on the substrate. The interaction part includes: first and second optical waveguides formed adjacent to each other on the substrate; and first and second signal electrodes provided so as to oppose the first and second optical waveguides respectively. o ground electrode is provided in a nearby region of the interaction part, and a ground electrode is provided in the vicinity of at least one of an input part and a terminal part electrically connected to each of the first and second signal electrodes.

To provide an optical modulation element whereby reduced drive voltage and suppression of DC drift can be obtained at the same time. An optical modulation element includes: a substrate; and an optical waveguide formed of an electrooptic material film formed on the substrate and having a ridge part which is a protruding portion, and a slab part having a smaller film thickness than the ridge part. The optical waveguide includes a first waveguide part having a first ridge width and a first slab film thickness and to which an RF signal is applied, and a second waveguide part having a second ridge width and a second slab film thickness different from the first slab film thickness and to which a DC bias is applied.

An optical waveguide element includes: an optical waveguide having a ridge part and a slab part having a thickness less than the ridge part. The optical waveguide includes: a first waveguide having a first ridge with and a first slab film thickness; a second waveguide having a second ridge width and a second slab film thickness; a first intermediate waveguide connected to the first waveguide and having a third ridge width and the first slab film thickness; and a second intermediate waveguide connected to the second waveguide and having a fourth ridge width and the second slab film thickness. The first waveguide, the first intermediate waveguide, the second intermediate waveguide, and the second waveguide are arranged in this order; the second slab film thickness is larger than the first slab film thickness; and the third ridge width is larger than the fourth ridge width.

Optical waveguide element and optical modulation element

An electro-optic device is provided with a substrate, an optical waveguide formed of a lithium niobate film with a ridge shape on the substrate, and an electrode that applies an electric field to the optical waveguide. The optical waveguide includes a first waveguide section provided at least in an electric field application region applied with the electric field and having a thickness of 1 &#x3bc;m or larger and a second waveguide section provided in a region other than the electric field application region and having a thickness of 0.3 &#x3bc;m or larger and less than 1 &#x3bc;m.

Electro-optic device

An electro-optic device is provided with a Mach-Zehnder optical waveguide including at least one linear section and at least one curved section and a differential RF signal electrode provided along the Mach-Zehnder optical waveguide. Optical input/output ports of the Mach-Zehnder optical waveguide are provided at one end side in a first direction in which the linear section extends. The differential RF signal electrode is provided in both the linear and curved sections.

An optical modulator is provided with a ridge-shaped optical waveguide formed of a dielectric thin film having electro-optic effect, a buffer layer covering the optical waveguide, a signal electrode formed on the buffer layer so as to be opposed to the optical waveguide through the buffer layer; a ground electrode formed on the buffer layer together with the signal electrode, and a dielectric film having a higher dielectric constant than air and covering at least a part of exposed surfaces of the signal electrode and ground electrode and exposed surfaces of the buffer layer.

An optical modulator is provided with a substrate, first and second optical waveguides each formed of a ridge-shaped electro-optic material film and disposed so as to be mutually adjacent on the substrate, a buffer layer covering upper surfaces of the first and second optical waveguides, first and second signal electrodes provided above the buffer layer so as to be opposed respectively to the first and second optical waveguides, and a dielectric layer covering at least one of a part of an exposed surface of the first signal electrode and a part of an exposed surface of the second signal electrode, and a part of an upper surface of the buffer layer. Differential signals are applied to the first and second signal electrodes.

A first disclosure is an optical fiber member equipped with two holding members that hold an optical fiber such that an end surface of the optical fiber is located on one end and a curving portion having a coat of the optical fiber is curved to be extended at another end; the holding members are provided with holding flat portions that sandwich an end portion of the optical fiber where the coat is removed such that the end surface of the optical fiber is located on the one end; at least any of the holding flat portions has an aligning groove to fix a position of the end portion of the optical fiber; the holding member is provided with a curved surface at a position adjacent to the curving portion in the extending direction D; and the two holding members are equal in thermal expansion coefficient.

Optical fiber member and optical fiber holder

In one embodiment, a power management apparatus creates a switching plan for switching control of opening/closing of a first switch provided between an energy storage device and a distribution system side, and a second switch provided between the energy storage device and a feeder side, both of which are not closed simultaneously. Further, the power management apparatus determines a switching control content to the first switch and the second switch, according to the created switching plan, and outputs a determined instruction to the first switch and the second switch. In this configuration, the power management apparatus determines presence or absence of interchange of regenerative power between trains up to an optional unit time later, based on train information including an operation diagram, and when the interchange of the regenerative power between the trains is present, creates the switching plan to close the first switch for the unit time, and when the interchange of the regenerative power between the trains is not present, creates the switching plan to close the second switch for the unit time.

Power management apparatus and power management system

An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Electronic circuit module component and method of manufacturing electronic circuit module component

The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adhering the insulating member as bottom of the opening hole, and making a metal plating as a conductor portion grow in the opening hole from the lower conductor layer. In the method, after metal plating has reached the conductor film, the metal plating is grown on the conductor film and the conductor portion as electrode, to thereby form a thickness enough to form an upper conductive layer.

Growing community of inventors

Tokyo, Japan

Hiroki Hara