Dai Nippon Printing Co., Ltd.

Hiroki Furushou

Chikao Ikenaga

Chiaki Hatsuta

Kentarou Seki

Yo Shimazaki

Hiroshi Mawatari

Jin Nishiyama

Yuji Narita

Atsuko Chigira

Toshio Sasao

A wiring board is disclosed. The wiring board includes a substrate including a first element, a diffusion layer in contact with the substrate and including a first metal element, and a first metal film in contact with the diffusion layer and including a second metal element. The diffusion layer has at least a region including the first element and the first metal element and a region including the first metal element and the second metal element. A concentration of the second metal element in the diffusion layer may decrease as it approaches the substrate in a depth direction. A concentration of the first element in the diffusion layer may decrease as it approaches the first metal film in the depth direction.

Wiring board and manufacturing method of the wiring board

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y&#x2265;950 and y&#x2265;23x&#x2212;1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Deposition mask, method of manufacturing deposition mask and metal plate

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y&#x2265;950 and y&#x2265;23x&#x2212;1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y&#x2265;950 and y&#x2265;23x&#x2212;1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is Tand a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T, TT&#x3c;4.5 &#x3bc;m is satisfied.

Growing community of inventors

Tokyo, Japan

Hiroki Furushou