Matsushita Electric Works, Ltd.

Sharp Kabushiki Kaisha Corporation

Panasonic Electric Works Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Hirokazu Yoshioka

Kentaro Kobayashi

Kenichiro Tanaka

Norio Yoshida

Akihide Sugawa

Shousuke Akisada

Osamu Imahori

Fumio Mihara

Kishiko Hirai, Legal Representative

Keiichi Tanaka

Atsuhito Murai

Satoru Kishimoto

Toshihisa Hirai

Kazuo Kamada

Shinya Murase

Yoshitaka Okumoto

Kouichi Hirai

Yasutoshi Murakami

Tomoharu Watanabe

Yoji Urano

Hiroshi Suda

Sumio Wada

Yasunori Matsui

Atsushi Isaka

Junji Imai

Tatsuhiko Matsumoto

Takayuki Nakano

Jun Tatsuta

Keita Katayose

Kousuke Katayama

Toshiyuki Yamauchi

Yutaka Miyajima

An electrostatically atomizing device includes different types of thermoelectric elements and an emitter electrode being configured to cause the electrostatically atomization. The emitter electrode is provided with a mounting member which the different types of thermoelectric elements are mounted on. The mounting member is provided with the electrical conductive path between the different types of thermoelectric elements.

Electrostatically atomizing device and method of manufacturing the same

The present invention provides a color filter substrate manufacturing method which can prevent the occurrence of color mixing between adjacent pixels despite of the use of an inkjet method, and which are unlikely to cause flicker when used for displays such as televisions. The prevent invention is a color filter substrate manufacturing method including: a first inkjet step of applying inks simultaneously to at least two of a plurality of regions separated by a grid-shaped partition; and a second inkjet step of applying an ink to at least one of regions to which the inks are not applied in the first inkjet step, wherein at least one of inks applied in the first inkjet step is a first ink that is applied to a first target region without applying inks to regions vertically and horizontally adjacent to the first target region, and at least one of the other inks applied in the first inkjet step is a second ink that is applied to a second target region while another ink is applied to one of regions vertically and horizontally adjacent to the second target region.

Color filter substrate manufacturing method, display device manufacturing method, color filter substrate, and display device

To provide: a color filter substrate with high display quality in which defective portions of a bank member (black matrix), such as a pin hole, a portion having an insufficient film thickness, a portion having an insufficient width, and a disconnection portion, or color mixing defects of a colored layer are corrected by the simple and inexpensive method; a liquid crystal display device including such a color filter; and production methods thereof. The color filter substrate of the present invention is a color filter substrate comprising a bank member and a colored layer on a substrate, wherein the color filter substrate has a structure in which a color mixing member formed of colored layer materials of two or more colors is formed in a defective portion of the bank member or along the bank member.

Color filter substrate, liquid crystal display device, production method of color filter substrate, production method of liquid crystal display device

This heating blower has a housing, a fan, a heater, and an electrostatic atomizing device. The electrostatic atomizing deviceis provided in the housingand discharges nanometer-size ion mist to the outside. The electrostatic atomizing devicecomprises a discharging electrode, an opposed electrodedisposed opposite the discharging electrode, a cooling partwhich cools the discharging electrodeto generate moisture from ambient air near the discharging electrode, and a high voltage applying partwhich applies a high voltage between said discharging electrode and the opposed electrode to atomize water generated near the discharging electrode. Therefore, this heating blower can discharge nanometer-size ion mist to the outside without replenishment of water.

Heating blower with electrostatic atomizing device

An electrostatically atomizing device capable of instantly giving an electrostatically atomizing effect without requiring a water tank. The electrostatically atomizing device includes an emitter electrode, an opposed electrode opposed to the emitter electrode, a water feeder configured to give water on the emitter electrode, and a high voltage source configured to apply a high voltage across said emitter electrode and said opposed electrode to electrostatically charge the water on the emitter electrode for spraying charged minute water particles from a discharge end of the emitter electrode. The water feeder is configured to condense the water on the emitter electrode from within the surrounding air, enabling to supply the water on the emitter electrode in a short time without relying upon an additional water tank. Thus, an atomization of the charged minute water particles can be obtained immediately upon use of the device.

Electrostatcially atomizing device

The present invention provides a substrate for display device, in which display quality can be improved by suppressing generation of a region not filled with liquid material for functional film (ink) in formation of a functional film, such as a colored layer in a color filter substrate of a liquid crystal display device and an organic layers such as a luminous layer and a positive hole transporting layer in an organic electroluminescent display device, by an application method such as an ink jet method, and a liquid crystal display panel, a liquid crystal display device and an organic electroluminescent device each comprising the substrate for display device. The substrate for display device according to the present invention comprises a bank on the substrate, the bank having a structure with a chamfered corner.

Substrate for display device

An electrostatically atomizing device includes an emitter electrode, an opposed electrode opposed to the emitter electrode, and a cooling means which condenses the water on the emitter electrode from within the surrounding air, and a high voltage source applying a high voltage across the emitter electrode and the opposed electrode to electrostatically charge the water for atomizing charged minute water particles from a discharge end of the emitter electrode. The device further includes a controller for discharging the charged minute water particles in a stable manner. The controller monitors a discharge current flowing between the two electrodes to control the cooling means for keeping the discharge current at a predetermined level, thereby regulating the atomizing amount of the charged minute particles from the emitter electrode.

Electrostatically atomizing device

A multilayer printed wiring board is formed with a plurality of conductor layers laminated as a whole with insulating layers interposed, a non-penetrating via hole provided in the insulating layer as bottomed by the conductor layer exposed, a plated layer provided inside the via hole for electric connection between the conductor layers, the via hole being formed to be of a concave curved surface of a radius in a range of 20 to 100 &mgr;m in axially sectioned view at continuing zone of inner periphery to bottom surface of the via hole, whereby the equipotential surfaces occurring upon plating the plated layer are curved along the continuing zone to unify the density of current for rendering the plated layer uniform in the thickness without being thinned at the continuing zone.

Multilayer printed wiring board and method for manufacturing same

A sintered body of a material for thermoelectric element having excellent thermoelectric performance and mechanical strength can be produced by the following method. A block of the material for thermoelectric element is provided. The block has an electric-current passing direction, in which electricity is supplied to obtain a desired thermoelectric performance of the thermoelectric element. The block is encased in an elongate capsule such that the electric-current passing direction of the block is substantially agreement with an axial direction of the capsule. After degassing the capsule, a forming operation for reducing a cross section perpendicular to the axial direction of the capsule is performed to obtain a formed capsule having a green compact of the block crushed by the forming operation therein. A heat treatment is then performed to sinter the green compact in the formed capsule. Finally, the resultant sintered body is removed from the formed capsule. This method is preferably used to manufacture a thermoelectric module that is a temperature control device using the Peltier effect.

Method of producing sintered body of material for thermoelectric element

A thermoelectric chip with exposed surfaces of N-type and P-type semiconductor elements on its top and bottom surfaces is prepared by arranging the semiconductor elements in a matrix manner such that each of the N-type semiconductor elements is disposed adjacent to the P-type semiconductor element through a space, and filling the space with a first resin material having electrical insulation. A metal layer is formed on each of the exposed surfaces of the semiconductor elements. Then, first electrodes are formed on the top surface according to a first circuit pattern. Similarly, second electrodes are formed on the bottom surface according to a second circuit pattern different from the first circuit pattern. An electrical insulation sheet of a second resin material containing a ceramic powder with high thermal conductivity is bonded to the top and bottom surfaces to obtain the thermoelectric module.

Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same

The printed circuit board comprises a substrate 1 including a part loading portion 3 into which an electronic part 5 can be loaded, a plurality of contact terminals 2 which are respectively formed on one surface of the substrate 1 and the surfaces of which are exposed to the outside to provide external contacts, and openings 4 respectively formed in the other surface of the substrate 1 for insertion of bonding wires 6 which are used to connect the electronic part 5, which are to be loaded into the part loading portion 3 of the substrate 1, to its associated contact terminals 2. In the printed circuit board, each of the contact terminals 2 is formed of a metal foil 9 directly and closely attached to the substrate 1. This can prevent the lowered heat resistance of a printed circuit board which occurs when the metal foil, which is used to form the contact terminals 2, is bonded to the substrate 1 using an adhesive.

Print circuit board

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Osaka, Japan

Hirokazu Yoshioka