Mitsubishi Denki Kabushiki Kaisha

Mayekawa Mfg. Co., Ltd.

Taikisha Ltd.

Hirokazu Yoneda

Tetsuya Watanabe

Kozo Ishida

Fujio Komatsu

A dehumidification forward passage is provided for guiding air withdrawn from a treating chamber as dehumidification-subject air A&#x2033; to an adsorption area of an adsorption/desorption type dehumidifying device. A dehumidification return passage is provided for guiding air A&#x2033; past through the adsorption area to the treating chamber. A desorption heat pump is provided for heating desorbing air HA to be flown through a desorption area of adsorption/desorption type dehumidifying device, with utilizing, as a heat sink, dehumidified air A&#x2033; which has flown through the adsorption area and sent to the dehumidification return passage. There is provided a sensible-heat heat exchanger configured to cool the dehumidification-subject air A&#x2033; present in the dehumidification forward passage through a heat exchange reaction with dehumidified air A&#x2033; present in the dehumidification return passage which has been cooled via absorption of its heat by the desorption heat pump.

Drying facility for painting

A semiconductor integrated circuit which effects the subtle control of the well or substrate potential of a circuit in accordance with the operating frequency, the signal multiplication rate from a PLL circuit, the source voltage or the operating state of the circuit, thereby adjusting the operating speed of the circuit and reducing the consumption of electricity.

Growing community of inventors

Tokyo, Japan

Hirokazu Yoneda