Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Hirokazu Yazaki

Keito Yonemori

Noboru Kato

Takanori Tsuchiya

Kuniaki Yosui

Noriyuki Ueki

Ryohei Omori

Mikiko Saito

Hiroshi Masuda

Atsushi Toujo

Ikuo Tamaru

Koji Kamada

Takashi Noma

Kenichi Ishizuka

Toshiyuki Nakaiso

Tomoya Yokoyama

Takako Sato

Shigetoshi Hayashi

Tomoyoshi Hiei

Yoshihiro Aoyama

Akihiro Ieda

A container including an RFID module is provided that includes a base, and an antenna pattern. The antenna pattern includes a first antenna film and a second antenna film on a first main surface of the base. The RFID module includes an RFIC element, a filter circuit, and first and second electrodes. The filter circuit is configured to transmit a current due to an electromagnetic wave at a natural resonance frequency to the RFIC element. The first and second electrodes are connected to the filter circuit. The first electrode of the RFID module and the first antenna film are electrically connected to each other. The second electrode of the RFID module and the second antenna film are electrically connected to each other. Moreover, a sheet resistance of each of the first antenna film and the second antenna film is 0.5Ω/sq or more.

Container provided with RFID module and method for manufacturing container provided with RFID module

A container including an RFID module is provided that includes a base, a metal film, and a slit. The base has an insulating property. The metal film is on a first main surface of the base. The slit separates the metal film into a first metal region and a second metal region. The RFID module includes an RFIC element, a filter circuit configured to transmit a current due to an electromagnetic wave at a natural resonance frequency being a communication frequency to the RFIC element, and first and second electrodes to be connected to the filter circuit. The first electrode of the RFID module and the first metal region of the metal film are electrically connected to each other. The second electrode of the RFID module and the second metal region of the metal film are electrically connected to each other.

Container including RFID module

An RFIC module is provided that includes a substrate, an RFIC mounted on the substrate and performing passive communication, and an impedance matching circuit formed on the substrate and performing impedance matching between the RFIC and an antenna. Further, the RFIC module includes a chip capacitor as an imparting circuit other than the RFIC on the substrate.

RFIC module and RFID tag

An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, an antenna pattern provided on the base material, and an expansion member. The expansion member is disposed adjacent to the antenna pattern and has a coefficient of linear expansion that is higher than coefficients of linear expansion of the antenna pattern. When the RFID tag is subjected to an electromagnetic wave heating microwave, and thus the temperature of each portion rises, the antenna pattern breaks at a position of the expansion member. With this configuration, ignition and combustion are able to be prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while being attached to the food item.

Wireless communication device

An RFID tag is provided for transmitting and receiving a communication signal. The RFID tag includes a base material, an antenna pattern disposed on the base material, and a high-loss member. The high-loss member is disposed adjacent to the antenna pattern and has a high loss at a frequency higher than a frequency of the communication signal, compared with the antenna pattern and the base material. When the RFID tag is subjected to an electromagnetic wave heating microwave, the high-loss member generates heat and the antenna pattern is cut at a position of the high-loss member.

A container is provided that includes an RFID module, and further includes an insulating base material that forms an outer shape of the container; a metal film formed on a first main surface of the insulating base material; and a slit formed in the metal film. Moreover, the RFID module includes an RFIC element, a filter circuit that transmits a current caused by an electromagnetic wave at a unique resonance frequency serving as a communication frequency to the RFIC element, and first and second electrodes connected to the filter circuit. The metal film is formed to wrap around an outer periphery of the container in a direction intersecting the slit, and the first and second electrodes of the RFID module are electrically connected to the metal film across the slit formed between the first electrode and the second electrode.

An RFID tag is provided that has reduced size while a decrease in communication distance is prevented. The RFID tag includes an inductor element having a coiled antenna built in a substrate and an RFIC element mounted on a mounting surface of the substrate and electrically connected to the coiled antenna. The coiled antenna is disposed such that a winding axis becomes parallel to or inclined with respect to the mounting surface of the substrate. The area of the RFIC element viewed in a direction orthogonal to the mounting surface of the substrate is larger than opening area of the coiled antenna viewed in winding axis direction of the coiled antenna. The RFIC element is disposed without overlapping at least a portion of opening region of the coiled antenna when viewed in winding axis direction of the coiled antenna.

RFID tag and method for producing the same

A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.

Circuit module and interposer

An RFID tag is providing for transmitting and receiving a communication signal. The RFID tag includes a base material, antenna patterns formed on the base material, and an RFIC package connected to the antenna patterns. The antenna patterns are defined by conductor patterns. The whole of the antenna patterns resonate at a communication frequency, and each of the plurality of conductor patterns has a line length that does not cause resonance at a frequency in a microwave band for electromagnetic wave heating higher than the communication frequency.

An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.

Interposer substrate, circuit module, and interposer substrate manufacturing method

A noise reduction circuit is connected between at least one line of an input line and an output line of a DC-DC converter, a ground, and a ground terminal of a switching control IC included in the DC-DC converter. The noise reduction circuit includes a first capacitor connected between the at least one line and the ground terminal, a second capacitor connected between the at least one line and the ground, and an inductor connected between the ground terminal and the ground.

Noise reduction circuit and noise reduction element

An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.

Interposer substrate and circuit module

In an impedance matching circuit, first to fourth inductors are formed by a conductor pattern of a coil shape, and a fifth inductor is formed by a conductor pattern of an unwound shape. The first inductor and the third inductor are respectively formed in different layers of a substrate and are arranged in such a relationship as to have coil openings overlapping each other. Moreover, the second inductor and the fourth inductor are respectively formed in different layers of the substrate and are arranged in such a relationship as to have coil openings overlapping each other. Two coils interposing the mounting position of the RFIC are in a 180&#xb0; rotational symmetry relationship.

An electronic component including a thin-film shield layer includes a wiring substrate, surface mount devices mounted to a first principal surface of the wiring substrate, a metal thin-film shield layer, and a magnetic metal thin-film shield layer. The metal thin-film shield layer includes a nonmagnetic metal material and entirely covers the surface mount devices at the top surface side and lateral surface side thereof. The metal thin-film shield layer includes a top surface portion and a lateral surface portion. The magnetic metal thin-film shield layer includes a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer, including an entire edge portion at which the top surface portion and the lateral surface portion are joined to each other.

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Nagaokakyo, Japan

Hirokazu Yazaki