Fujitsu Corporation

Hirokazu Yamanishi

Yoshiaki Yanagida

Shunsuke Sone

Tohru Harada

Hidehiko Kira

Norio Kainuma

Shinji Hiraoka

Kazuhisa Mishima

Hiroshi Kobayashi

Atsushi Suzuki

Kenji Kobae

Takayoshi Matsumura

Toru Okada

Katsuyoshi Matsuura

Fumitake Mieno

Shuichi Takeuchi

Atsuhiro Tsukune

Mitsuo Takeuchi

Toshinori Kasuga

Kiyokatsu Suzuki

An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Apparatus for mounting electronic component

A manufacturing apparatus for an electronic component includes a plurality of press members provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, the plurality of press members contacting a housing of a connector and pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit coupled with the pair of arm sections and adapted to measure a stress generated at the pair of arm sections when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.

Manufacturing apparatus and manufacturing method for an electronic component

An operation position locating system locates a position on a product where an operation is performed in a manufacturing process of the product including one or more operations to be performed. The system includes an operation completion coordinates detection unit and an operation position locating unit. The operation completion coordinates detection unit processes a plurality of images obtained by capturing from a plurality of viewpoints a range including an operation completion position where an operation is completed when the operation is completed, thereby detecting a set of operation completion coordinates representing the operation completion position. The operation position locating unit obtains a set of operation coordinates representing an operation position where the operation is to be performed on each operation, and locates the operation position corresponding to the operation completion position based on the set of operation completion coordinates and the one or more obtained sets of operation coordinates.

System, operation cell, method, product manufacturing method, and marker for locating operation position

Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Film sticking device, film sticking method, and electronic paper manufacturing method

An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image, a position adjusting unit which adjusts, based on the detected position of the alignment mark, the position of the planar member relative to a reference position, and an orientation detection unit which detects an orientation of the planar member based on the rotational asymmetry of the alignment mark captured in the image.

Alignment apparatus and fabrication apparatus for planar member and alignment method and fabrication method for planar member

An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium. The apparatus for processing a magnetic head slider includes a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider is disposed, an elevating unit configured to bring the magnetic head slider into contact with the discoid recording medium in a sliding manner by elevating and lowering the discoid recording medium, and a rotating unit configured to rotate the discoid recording medium at a rotation speed lower than a rotation speed upon the magnetic recording/reproducing process.

Apparatus for processing a magnetic head slider

An electronic apparatus includes a housing, a first unit that is attached through a front side of the housing, a second unit that is attached through a backside of the housing, a panel that has a first surface connected to the first unit, and a second surface connected to the second unit, and establishes an electric connection between the first unit and the second unit, and a support member to which the panel is attached, the support member being movable relative to the housing in a side surface direction of the housing.

Electronic apparatus

A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support partthat tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic bodycomposed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Slider tester

The slider tester is capable of solely testing a slider and securely selecting good sliders so as to reduce wasteful costs. The slider tester, which tests reading and writing functions of a slider for reading data from and writing data on a recording medium, includes a testing device for testing the functions of the slider, and a setting plate holding the slider and electrically connecting the slider to the testing device. The setting plate separates the slider a prescribed distance from the recording medium during the test so as to read data from and write data on the recording medium, wherein the slider can be independently attached to and detached from the setting plate.

An apparatus and method for manufacturing a semiconductor device includes a reaction chamber adapted to exhaust gas therefrom, and a cleaning gas supplying system for introducing cleaning gas containing ClF.sub.3 into the reaction chamber, the system having a plurality of gas blowout holes formed in the flow direction of gas at least in the reaction chamber. The reaction chamber may be a tubular chamber, and the cleaning gas supplying system may be a tube extending from one end to the other end of the reaction chamber along the inner wall or the central axis of the reaction chamber, a plurality of through holes being formed in the side wall of the tube. Damages to the inner surface of the reaction chamber of the semiconductor device manufacturing apparatus can be suppressed and a film attached to the inner wall of the reaction chamber can be removed in a short time.

Growing community of inventors

Kawasaki, Japan

Hirokazu Yamanishi