Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Hirokazu Uchiyama

Hideki Kuwajima

Yuko Ogawa

Hiroyuki Kita

Hiroshi Adachi

Tomokiyo Yamada

Kaoru Matsuoka

Toshiyuki Matsunaga

Terumi Yanagi

Hirosuke Mikami

Masaki Hashimoto

Yoshihisa Matsuda

Fumiyo Tojo

Nobuo Itazu

There is provided a method for manufacturing an optical element comprising a base material, and a stack covering of layers formed on the base material. The method of the present disclosure comprises a multi-layers forming step for forming an optical multi-layered part of the stack covering, and an outermost surface forming step for forming an outermost surface part of the stack covering. A pressure condition for the formation of the stack covering is made discontinuous between the multi-layers forming step and the outermost surface forming step. In the outermost surface forming step, a silicon oxide-containing layer is formed prior to a formation of a fluorine compound-containing layer.

Optical element and method for manufacturing the same

A cover, which is intended for a camera, includes: a base material and a laminated layer formed on the base material. The base material includes resin. The laminated layer includes: a contact layer that includes a siloxane acrylic resin, an acrylic resin including silica, or a silane acrylic resin; a hydrophilic layer that includes a silane acrylic resin; and an intermediate layer that includes resin and serves as a binder to bind the contact layer and the hydrophilic layer. The contact layer is disposed closest to the base material, among the contact layer, the intermediate layer, and the hydrophilic layer.

Cover, camera, and method of manufacturing cover

An optical member includes a substrate and a thin film that is disposed on the substrate and contains inorganic particles and a resin. The resin has a volume occupancy of less than 5% in a region up to at least 60 nm in depth from a surface of at least a part of the thin film, the surface being opposite from a substrate-end surface of the thin film.

Optical member and method for manufacturing the same

A piezoelectric film device has a piezoelectric film element and a power supply circuit. The piezoelectric film element is formed of a first electrode, a second electrode, and a piezoelectric film that is sandwiched between the first electrode and second electrode and has a polarization vector in the film thickness direction. The polarization vector is inverted by application of a predetermined voltage or higher through the first electrode and second electrode. The power supply circuit supplies voltage for inverting the polarization vector. The piezoelectric film has each different lattice constant depending on the direction of the polarization vector. The piezoelectric film device keeps a different displacement position corresponding to the direction of the polarization vector even when the voltage application is stopped.

Piezoelectric film device, and driving method of the same

A first counter electrode and a second counter electrode, for electrically coupling a first piezoelectric element unit and a second piezoelectric element unit, for composing a thin film piezoelectric element are common floating electrodes. A first principal electrode film and a second principal electrode film of each piezoelectric element unit are connected, and a voltage is applied between the two piezoelectric element units. As a result, by the wiring of two terminals only without using grounding electrode wiring, the first piezoelectric element unit and second piezoelectric element unit can be driven, so that the wiring process may be substantially simplified.

Thin film piezoelectric element; actuator, head support mechanism, and disc recording and reproducing device using the thin film piezoelectric element; and method of manufacturing the thin film piezoelectric element

Two piezoelectric thin films each sandwiched between a main electrode layer and an opposite electrode layer are laminated in pairs so as to form a thin film piezoelectric element. An electrode leading area has a region in which the main electrode layer partially projects from the piezoelectric thin film, and another region in which only an insulating layer is formed on a part of the opposite electrode layer. At least one of a first opening formed through the insulating layer in the former region and a second opening formed through the insulating layer in the latter region is provided. A connection wiring for connecting to the opposite electrode layer or the main electrode layer and leading to the surface layer is formed via the opening.

Thin film piezoelectric element, method of manufacturing the same, and actuator

A piezoelectric actuator, the manufacturing method of the same and the head suspension assembly using the same are disclosed, wherein the piezoelectric actuator can be disposed easily without any breakage in mounting and can provide a magnetic head with fine displacements efficiently. More specifically, a first coupling portion and a second coupling portion are provided to couple the first piezoelectric element unit in parallel with the second piezoelectric element unit without being influenced each other by respective displacements. The configuration can provide a head suspension assembly with a high head positioning accuracy.

Piezoelectric actuator, disk drive using the same and manufacturing method thereof

To provide a piezoelectric thin-film element small in leak current between electrode metal films and its manufacturing method are presented, the piezoelectric thin-film element includes at least one unit laminated body composed of a piezoelectric thin-film having a mutually facing first surface and second surface, a first electrode metal film on the first surface, and a second electrode metal film on the second surface, in which an electrode separation surface composed of a piezoelectric thin-film surface parallel to the first surface is provided between the first electrode metal film and second electrode metal film.

Piezoelectric thin-film element and a manufacturing method thereof

An actuator comprises first and second structures each with a piezoelectric layer sandwiched between a main electrode layer and an opposed electrode layer, which structures are formed on two substrates, respectively. A first main electrode layer and a first opposed electrode layer are provided with layer two projections, and a second opposed electrode layer is provided with one layer projection. Connection wiring is arranged for establishing connection, with the above two structures bonded to each other, between the layer projection of the first main electrode layer and the second main electrode layer, and between the layer projection of the first opposed electrode layer and the layer projection of the second opposed electrode layer. Thus, it is possible to provide an actuator which may assure highly accurate position control.

Magnetic disc device piezoelectric actuator with mirror-symmetrical relationship and connection arrangement

A method comprises: bonding a plurality of thin film piezoelectric elements, formed on a substrate, onto a temporary fixing substrate via an adhesive layer; selectively removing the substrate to expose the thin film piezoelectric elements; fixing an element housing jig having sectional regions for individually isolating the thin film piezoelectric elements in such manner that the thin film piezoelectric elements and the sectional regions correspond to each other; and dissolving and removing the adhesive layer, and housing the thin film piezoelectric elements in the sectional regions of the element housing jig. Accordingly, it is possible to individually isolate and house the thin film piezoelectric elements removed from the substrate.

Method of manufacturing thin film piezoelectric element, and element housing jig

A method for making thin film piezoelectric elements including forming a flat-plate laminate by laminating a first electrode layer, a piezoelectric thin film, and a second electrode layer, on one surface of an element forming substrate, and forming on the one surface a plurality of thin film piezoelectric elements including connecting electrodes for electrically connecting the first electrode layer and the second electrode layer to external equipment, including forming the element holding layer including resin over the one surface of the substrate including the thin film piezoelectric elements; bonding the one surface of the substrate, opposed to a temporary fixing substrate and covered with the element holding layer, on the temporary fixing substrate by using a fixing resin; covering a peripheral area with a specified width; and removing the element forming substrate by etching in an area other than the area covered with the fixing resin, and separating the thin film piezoelectric elements held by the element holding layer, into individually separate elements or groups of elements.

Method of manufacturing thin film piezoelectric elements

A thin film piezoelectric element used in an actuator unit for fine positioning, and its manufacturing method, the manufacturing method including laminating two piezoelectric thin films held between electrode layers by using adhesive, and selectively removing only the second substrate in order to process the thin films remaining on the first substrate into a plurality of separated structures. After that, an insulating layer and external connecting electrode are formed to cover the exposed surface of the structure, thereby forming a plurality of thin film piezoelectric elements. Resin is applied to cover the thin film piezoelectric element, and a temporary fixing substrate is bonded thereto, and after selectively removing the first substrate, the temporary fixing substrate is separated, and the resin is removed from the piezoelectric element surface in order to separate the plurality of thin film piezoelectric elements.

Method of manufacturing a thin film piezoelectric element

A thin film piezoelectric element including a first structure having a sequential stack of layers, a first main electrode layer, a first opposed electrode layer and a first piezoelectric thin film having a first polarizing direction located between the first electrode layers, a second structure having as a sequential stack of layers, a second main electrode layer, a second opposed electrode layer and a second piezoelectric thin film having a second polarizing direction located between the second electrode layers, an insulating resin layer covering peripheral portions of the first and second structures, and at least one connecting electrode pad located at a side of one of the first and second structures, for connecting the main electrode layer and the opposed electrode layer of the structures to external equipment, wherein each first and second structures has a cross-sectional shape such that the piezoelectric thin film is tapered, diminishing in width, from a portion near the main electrode layer to a portion near the opposed electrode layer, and the first and second opposed electrode layers of adjacent structures are bonded to each other, and each polarizing direction of the piezoelectric thin films is identical to the direction of each opposed electrode layer.

Thin film piezoelectric element

A method of manufacturing a thin film piezoelectric element, wherein main electrode layer, piezoelectric thin film, and opposed electrode layer respectively having specified shapes are first formed on first substrate and second substrate, and after that, the opposed electrodes are opposed and bonded to each other, and insulating resin layer is formed over the peripheral portion thereof, and then the second substrate is removed, the insulating resin layer is etched, and connecting electrode pad is formed, and finally, the first substrate is removed to obtain a completely separated thin film piezoelectric element. By this method, it is possible to improve the reproducibility of shapes and to prevent trouble such as shorting between the electrodes which hold the piezoelectric thin film, thereby making it possible to provide a thin film piezoelectric element that may assure high yield without variation in piezoelectric characteristics, and its manufacturing method.

A piezoelectric driving device of the present invention prevents a short circuit from occurring between electrode metallic films even if bonding-wire is performed. The piezoelectric driving device is a piezoelectric driving device in which a piezoelectric thin plate is joined to one side of a substrate, and a terminal electrode for applying a signal for expanding or contracting the piezoelectric thin plate is further formed on the plane. The terminal electrode is formed on one side of the substrate via a piezoelectric-member pedestal separated from the piezoelectric thin plate.

Growing community of inventors

Osaka, Japan

Hirokazu Uchiyama