Oki Semiconductor Co., Ltd.

Oki Electric Industry Co., Ltd.

Hirokazu Uchida

Yoshio Itoh

Yoshimasa Kushima

Tomoyuki Terashima

The semiconductor device comprises a first area and a second area positioned adjacent to the outside of the first area, the semiconductor substrate having a main surface and side surfaces and disposed in such a manner that the main surface is positioned in the first area and each of the side surfaces is positioned at a boundary between the first area and the second area, a plurality of pads formed over the main surface of the semiconductor substrate and a plurality of external connecting terminals formed thereon, which are respectively electrically connected to the pads, a first resin portion which is formed over the main surface of the semiconductor substrate so as to cover the pads and has a main surface and side surfaces, and which is formed in such a manner that the external connecting terminals are exposed from the main surface and each of the side surfaces is positioned at the boundary, and a second resin portion which is positioned in the second area and formed so as to cover the side surfaces of the semiconductor substrate and the side surfaces of the first resin portion and which is different in composition from the first resin portion.

Semiconductor device and manufacturing method thereof

To provide a semiconductor substrate whose columnar member for alignment is difficult to fall off and a manufacturing method thereof. An alignment mark(columnar member for alignment) and protection postssurrounding the alignment markto protect the alignment mark are disposed in an alignment mark forming regionof a semiconductor wafer(semiconductor substrate). Each of the protection posts has a diameter (maximum diameter) of, for example, 0.6 &#x3bc;m. The protection postsare arranged such that the diameter of each of the columnar protection postsis greater than a diameter (for example, 0.2 &#x3bc;m) of the alignment mark. That is, the protection postsare arranged such that the contact area between each of the protection postsand an underlayer thereof (dummy wire layer) is greater than the contact area between the alignment markand an underlayer thereof (dummy wire layer).

Substrate including alignment columnar member and plural protection columnar members, and method of making the same

A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.

Growing community of inventors

Saitama, Japan

Hirokazu Uchida