Shinko Electric Industries Co., Ltd.

Hirokazu Tsukioka

Tetsuichiro Kasahara

Shintaro Hayashi

Hirofumi Haniuda

A process for manufacturing an IC card includes a step of forming a plane coil by etching or punching a thin metal plate so that the plane coil consists of a conductor line wound as several loops in substantially the same plane and has respective terminals. A semiconductor element having electrodes is mounted on the plane coil. An adhesive agent or tape is attached to a predetermined area of the plane coil so that adjacent conductor lines in the loops are kept a predetermined gap therebetween. The plane coil is disposed between a pair of films to cover the plane coil therebetween, one of the films being provided with adhesive layer on a surface facing to the other film to seal the plane coil with the semiconductor element by attaching the pair of films with respect to each other by means of the adhesive layer.

Process for manufacturing IC card

There is provided an IC card having a plane coil in which a short circuit is seldom caused by the deformation generated by an external force given to the plane coil in the traverse direction. An IC card comprises a rectangular plane coil formed by punching or etching a thin metallic sheet in which a conductor line is wound a plurality of times on substantially the same plane, wherein terminals at both ends of the plane coil and electrode terminals of a semiconductor element are electrically connected with each other, and a bent portion composed of a curved portion in which the conductor on each winding composing a linear portion of the plane coil is curved at the substantially same position in the same direction is formed in the conductor on each winding of the plane coil

Growing community of inventors

Nagano, Japan

Hirokazu Tsukioka