Sony Semiconductor Solutions Corporation

Sony Corporation

Asahi Glass Company, Limited

Lasertec Gmbh

Hirokazu Seki

Katsuji Kimura

Yuji Takaoka

Yuta Momiuchi

Rei Takamori

Kiyohisa Tanaka

Hirokazu Nakayama

Susumu Suzuki

Eiichirou Kishida

Miyoshi Togawa

Koichi Suzuki

Eiichi Ando

Go Asayama

Nobutaka Aomine

Junichi Ebisawa

Yasuo Hayashi

Yoshihiro Kato

Yuki Urano

Masakazu Baba

Emi Nishioka

Masashi Tada

Makoto Torizawa

Yoshihiro Nakano

Toshiyuki Todoroki

Masamichi Shinoda

Naoki Yamashita

Kiyoharu Momosaki

An inspection device according to one aspect of the present disclosure includes an image capturing unit configured to capture an image of an EUV mask provided with a pattern, a storage unit configured to store a database intermediate file including a gray image obtained by pixelating a binarized image rasterized from design data of the pattern, and a processing unit configured to inspect the EUV mask on the basis of a captured image obtained by the image capturing unit capturing an image of the EUV mask. The processing unit includes a conversion model generated by a learning machine configured to perform learning by deep learning, a reference image generation unit configured to generate a reference image from the gray image by using the conversion model, and a comparison unit configured to compare the reference image with the captured image.

EUV mask inspection device, EUV mask inspection method, non-transitory computer-readable medium storing EUV mask inspection program, and EUV mask inspection system including a gray image based on design data of a pattern

An imaging apparatus according to an embodiment includes: a solid-state imaging element () that has a light-receiving surface on which light-receiving elements are arranged in a two-dimensional matrix manner, a glass substrate () that is arranged on the light-receiving surface of the solid-state imaging element, and an infrared cut filter () that is arranged on a second surface of the glass substrate via a cavity layer (), where the second surface is opposite to a first surface facing the light-receiving surface.

Imaging apparatus

Provided is an imaging device that includes a first coil that moves a lens that collects light from a subject, in an optical axis direction of the light in accordance with a first magnetic field and that moves together with the lens, a second coil for moving the lens in a direction perpendicular to the optical axis in accordance with a second magnetic field, and a third coil for detecting the first magnetic field. The second coil and the third coil are arranged on a same substrate.

Imaging device

The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.

Camera module, production method, and electronic device

The present technology relates to an imaging device and an electronic device that enable highly accurate adjustment of a focus position and a camera shake correction position. The device includes: a lens that focuses subject light; an imaging element that photoelectrically converts the subject light from the lens; a circuit substrate including a circuit that externally outputs a signal from the imaging element; an actuator that drives the lens with a Pulse Width Modulation (PWM) waveform in at least one of an X-axis direction, a Y-axis direction, or a Z-axis direction; and a detection unit that detects a magnetic field generated by a coil included in the actuator. The actuator drives the lens to move a focus, or drives the lens to reduce an influence of camera shake. The present technology can be applied to the imaging device.

Imaging device and electronic device enabled to control position of lens

A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.

Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus

The present technology relates to a semiconductor device including: a solid-state image sensor having a pixel array unit in which a plurality of pixels each having a photoelectric conversion element is two-dimensionally arranged in a matrix; and a flexible printed circuit having wiring adapted to connect a pad portion provided on an upper surface side to be located on a light receiving surface side of the solid-state image sensor to an external terminal provided on a lower surface side opposite to the upper surface side, in which the flexible printed circuit is arranged along respective surfaces of the solid-state image sensor such that a position of an end portion located on the upper surface side becomes a position different from a position in a space above the light receiving surface.

Image sensor package with flexible printed circuits

The present technology relates to an imaging element package and a camera module capable of improving reliability. An imaging element package includes a flexible substrate, an imaging element connected to a first surface of the flexible substrate, and a member, bonded to a second surface of the flexible substrate opposite to the first surface with an adhesive, having a linear expansion coefficient different from the flexible substrate, in which in a portion of the adhesive, a slit is formed which intersects with a direction from the imaging element toward an end of the flexible substrate as viewed from a direction perpendicular to the flexible substrate. The present technology is applied to a camera module.

Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients

Provided are a defect classifying method and an inspection apparatus which are capable of classifying a defect by distinguishing a basal plane dislocation, which is a killer defect in bipolar high-voltage elements, from other defects. The defect classifying method according to the present invention includes: projecting an illumination beam toward a silicon carbide substrate and forming a reflection image and a photoluminescence image; a first inspection step of detecting a defect image from the reflection image formed; a second inspection step of detecting a defect image from the photoluminescence image formed; and a defect classification step of classifying detected defects based on whether or not the defect image is detected and the shape of the detected defect image.

Defect classifying method and optical inspection apparatus for silicon carbide substrate

A functional product having a transparent oxide layer and a silver layer alternately laminated on a transparent substrate in a total number of (2n+1) layers, where n.gtoreq.1, wherein an oxide film whose major component is an oxide containing tin and silicon, is formed on the outermost layer.

Functional product

A laminate which comprises a transparent substrate, a first oxide layer comprising ZnO which contains at least one metal, a first metallic layer comprising Pd-containing Ag and a second oxide layer comprising SnO.sub.2 or ZnO which contains at least one metal, wherein said layers are formed on the substrate in this order.

Growing community of inventors

Oita, Japan

Hirokazu Seki