Polyplastics Co., Ltd.

Hirokazu Ohshiba

Kazufumi Watanabe

Raita Nishikawa

Hiroki Fukatsu

Seiji Kayukawa

Toshio Shiwaku

Mineo Ohtake

Takayuki Miyashita

Kenichi Yasusaka

The present invention provides a planar connector having excellent performances including flatness, warp-deformation resistance, and heat resistance, being capable of responding to shape changes in recent planar connectors. Specifically, the planar connector is composed of a composite resin composition comprises (A) a liquid crystalline polymer containing 55% by mole or less of p-hydroxy benzoic acid residue and having a melting point of 330&#xb0; C. or higher, (B) a plate-like inorganic filler, and (C) a fibrous filler having a weight average fiber length within a range of 250 to 600 &#x3bc;m, the amount of (B) component being 25 to 35% by weight to the total composition, the amount of (C) component being 10 to 25% by weight to the total composition, the sum in total of (B) component and (C) component being 40 to 50% by weight to the total composition, wherein the connector has a lattice structure inside an outer frame, and has an opening inside the lattice area, and wherein the pitch interval of the lattice area is 1.5 mm or less, and the ratio of the thickness of the thickness of the lattice area to the outer frame area is 0.8 or less.

Planar connector

The present invention provides a liquid crystalline polyester resin composition which imparts a good mold-releasability during molding and further is improved in heat resistance. Specifically, with 100 parts by weight of a liquid crystalline polyester resin is added 0.001 to 1 part by weight of a fatty acid ester which is a tetraester of pentaerythritol and a C10 to C32 higher fatty acid and has an acid value ranging from 0.01 to 0.5 and a hydroxyl value ranging from 0.01 to 5.

Liquid crystalline polyester resin composition

Provided is a material capable of forming a molded product which has good mechanical properties with low warpage while being excellent in any of the performance including heat resistance and flowability, even if the molded product is an asymmetric electronic parts. Specifically, the asymmetric electronic parts is prepared by molding a liquid crystalline polymer composition comprising (A) a fibrous filler having an average fiber diameter within the range of 5 to 30 &#x3bc;m, having a weight average fiber length within the range of 250 to 350 &#x3bc;m, excluding 10 &#x3bc;m or shorter fiber length, and having a content of a fibrous filler being 700 &#x3bc;m or longer within the range of 5% by weight or less; and (B) a plate-like filler having an average particle size within the range of 0.5 to 200 &#x3bc;m, the total filling amount of (A) and (B) components in the composition being within the range of 40 to 60% by weight, the weight ratio of (A) component being within the range of 10 to 20% by weight, the weight ratio of (B) component being within the range of 30 to 40% by weight, the molded product having no symmetry in any of the axial plane XY, the axial plane YZ, and the axial plane XZ of the molded product.

Asymmetric electronic parts

The present invention provides a very thin planar connector having 2 mm or smaller pitch interval at the lattice area and 0.5 mm or smaller thickness of the lattice area, giving excellent performance in the whole performances such as moldability, flatness, warp-deformation, and heat resistance. A planar connector having a lattice structure within an outer frame is molded by using (C) a resin composition prepared by compounding (A) a liquid-crystalline polymer with (B) a fibrous filler, while the relation between the compounding quantity and the weight-average length of (B) the fibrous filler is controlled to a specified range.

Growing community of inventors

Shizuoka, Japan

Hirokazu Ohshiba