Kabushiki Kaisha Toshiba

Hirokazu Niki

Yasunobu Onishi

Rumiko Hayase

Yoshihito Kobayashi

Naohiko Oyasato

Toru Ushirogouchi

Kazuo Sato

Akinori Hongu

Nobukazu Suzuki

Masao Yamamoto

Shuji Yamada

Motoya Kanda

Ken Uchida

Kenji Chiba

Makoto Nakase

Takuya Naito

Shinji Tsuruta

Takao Hayashi

Yuu Kondou

Yoshiko Kanazawa

Kunihiko Sasaki

Hiromitsu Wakabayashi

Koji Hashimoto

Koji Asakawa

Satoshi Saito

Naomi Shida

Naoko Kihara

Shuzi Hayase

Tsukasa Tada

Toshiaki Shinozaki

Masataka Miyamura

Akitoshi Kumagae

Osamu Sasaki

Koji Hasimoto

Noahiko Oyasato

Shuzi Nayase

Kunihiro Ikari, Deceased

Takashi Jonai

A resist composition for forming a pattern, which comprises (a) a compound represented by the following formula (1) and satisfying the following inequalities, ##STR1## wherein R.sup.1 is hydrogen atom or methyl group, R.sup.2 is a monovalent organic group, m is 0 or a positive integer, n is a positive integer, and m and n satisfying a condition of 0.03.ltoreq.n/(m+n).ltoreq.1, (b) a compound capable of generating an acid when irradiated with light, and (c) 4-phenylpyridine, wherein a weight-average molecular weight, Mw and a number-average molecular weight, Mn satisfy the following inequality, 4,000.ltoreq.Mw.ltoreq.50,000, 1.10.ltoreq.Mw/Mn.ltoreq.2.50 (Mw and Mn respectively represent value converted in styrene).

Resist composition for forming a pattern and method of forming a pattern

Disclosed are a safe slurry photosensitive composition superior in image formation capabilities such as resolution and sensitivity and containing no harmful compound, and a safe water-soluble photosensitive composition capable of being dissolved in water without using any organic solvent while maintaining a sufficient sensitivity as a resist and containing no harmful substance. The slurry photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, at least one type of a resin with acid-crosslinkability or acid-decomposability, and a powder. Various devices can be manufactured by forming a layer of this photosensitive composition on a substrate, exposing the layer to light in accordance with a desired pattern, and heating the layer. The water-soluble photosensitive composition contains a compound which generates an acid when irradiated with light or ionizing radiation, and an acetal resin. This water-soluble photosensitive composition is coated on a substrate and irradiated with light or ionizing radiation in accordance with a desired pattern. The resultant substrate is chemically amplified by heating and developed with water. This makes it possible to safely form a pattern without using any ventilator.

Photosensitive composition

A resist composition for forming a pattern, which comprises (a) a compound represented by the following formula (1) and satisfying the following inequalities, ##STR1## wherein R.sup.1 is hydrogen atom or methyl group, R.sup.2 is a monovalent organic group, m is 0 or a positive integer, n is a positive integer, and m and n satisfying a condition of 0.03.ltoreq.n/(m+n).ltoreq.1, (b) a compound capable of generating an acid when irradiated with light, and (c) a nitrogen-containing compound, wherein a weight-average molecular weight, Mw and a number-average molecular weight, Mn satisfy the following inequality, 4,000.ltoreq.Mw.ltoreq.50,000, 1.10.ltoreq.Mw/Mn.ltoreq.2.50 (Mw and Mn respectively represent value converted in styrene).

Resist composition for forming a pattern comprising a pyridinium

Disclosed herein is a resist for forming patterns, which is greatly sensitive to ultraviolet rays an ionizing radiation, and which can therefore form a high-resolution resist pattern if exposed to ultra violet rays or an unionizing radiation. Hence, the resist is useful in a method of manufacturing semicon ductor devices having high integration densities. The resist comprises tert-butoxycarbonyl methoxypolyhydroxy styrene and an o-quinonediazide compound.

Method for forming resist patterns

In a fuel cell comprising a stack having superposed a plurality of electromotive parts composed of a fuel electrode, an oxidizing electrode, and an electrolyte layer nipped by the two electrodes and using a liquid fuel as the fuel for the fuel cell, this invention contemplates forming a liquid fuel introducing path destined to be directly exposed to the liquid fuel on terminal surfaces of the component parts of the electromotive parts in a direction perpendicular to the flow of an oxidizing gas along at least one of the outer peripheral surfaces of the stack including the terminal surface of the fuel electrode and lying parallelly to the flow of the oxidizing gas and enabling the liquid fuel in the liquid fuel introducing path to be supplied to the fuel electrodes by a capillary attraction. A fuel cell provided with means for recovery of the water produced by the cell reaction in the oxidizing electrodes is also disclosed, which fuel cell effects the removal of the water produced in the oxidizing electrodes during the operation of the fuel cell by a capillary attraction generated by two porous members, i.e. a first porous member disposed in the oxidizing electrodes and a second porous member adjoined to the first porous member and possessed of a smaller average pore diameter than the first porous member.

Fuel cell

Resist for forming patterns comprising an acid generating compound and a

On a substrate a protective layer is formed which can suppress the diffusion of a contaminant from the substrate. On the protective layer, thus formed, a resin layer is formed. The resin layer comprises a photosensitive composition containing a compound which has a substituent group capable of being decomposed or cross-linked in the presence of an acid, and a compound which can generate an acid when exposed to light. The resin layer is pattern-exposed to light and then baked at a predetermined temperature. The resin layer is developed, whereby the exposed portions of the resin layer are removed or left, thus forming a pattern comprising lines and spaces each having a predetermined width. Each of the lines of the pattern has a cross-section having neither sloped profile nor undercut profile, and the pattern therefore has an improved resolution.

Pattern forming method

In a fuel cell comprising a stack having superposed a plurality of electromotive parts composed of a fuel electrode, an oxidizing electrode, and an electrolyte layer nipped by the two electrodes and using a liquid fuel as the fuel for the fuel cell, this invention contemplates forming a liquid fuel introducing path destined to be directly exposed to the liquid fuel on terminal surfaces of the component parts of the electromotive parts in a direction perpendicular to the flow of an oxidizing gas along at least one of the outer peripheral surfaces of the stack including the terminal surface of the fuel electrode and lying parallelly to the flow of the oxidizing gas and enabling the liquid fuel in the liquid fuel introducing path to be supplied to the fuel electrodes by a capillary attraction. A fuel cell provided with means for recovery of the water produced by the cell reaction in the oxidizing electrodes is also disclosed, which fuel cell effects the removal of the water produced in the oxidizing electrodes during the operation of the fuel cell by a capillary attraction generated by two porous members.

A radiation-sensitive layer comprising as a main component a radiation-sensitive composition containing a compound capable of generating an acid when exposed to a chemical radiation and a compound having at least one linkage decomposable by an acid is formed on a substrate. An acidic coating layer is formed on the radiation-sensitive layer. The radiation-sensitive layer and the acidic coating layer are pattern-exposed to a chemical radiation. The radiation-sensitive layer and the acidic coating layer are baked and developed by using an aqueous alkaline solution to obtain a pattern comprising lines and spaces, each having a predetermined width. A fine pattern of a rectangular sectional shape can be formed without producing eaves caused by a surface inhibition layer layer, which is produced on the film surface.

Pattern forming method including the formation of an acidic coating

Disclosed is a pattern formation resist which can be exposed with deep UV, has a high dry etching resistance, has a large allowance in a development manipulation using an aqueous alkali solution, and can form a fine pattern having a good sectional shape. The resist comprises an alkali-soluble polymer and a compound represented by the following formula (I) and simultaneously containing, in a single molecule, a substituent which decomposes with an acid and a group which produces an acid with deep UV: ##STR1## wherein the substituent which decomposes with an acid is present in at least one of R.sub.1 to R.sub.4, and when R.sub.1 to R.sub.4 have a group except for the substituent which decomposes with an acid, R.sub.1 represents a nonsubstituted or substituted aliphatic hydrocarbon group, each of R.sub.2 and R.sub.3 independently represents a hydrogen atom or a non-substituted or substituted aliphatic hydrocarbon group, and R.sub.4 represents a nonsubstituted or substituted aliphatic hydrocarbon group.

Pattern formation resist and pattern formation method

A pattern forming method, comprising the steps of providing a resist film on a substrate; providing a photosensitive film containing a photosensitive diazonium salt on the resist film; and then subjecting the resultant composite to pattern exposure by use of a light to which both of the resist film and the photosensitive diazonium salt are sensitive, can employ a composition for pattern formation which comprises a photosensitive diazonium salt, a resin binder and a solvent. By this method, a minute pattern of 1 .mu.m or less can be formed, utilizing effectively the UV-ray exposure technique of the prior art, with good dimensional precision and stability.

Pattern forming method utilizing material with photoresist film

A photosensitive composition contains an alkali-soluble polymer having a phenol skeleton in its structure and a heterocyclic compound represented by formula (I-1) or (I-2), formula (II-1) or (II-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) described in the claims and specification. A photosensitive composition containing a heterocyclic compound represented by formula (I-1) or (I-2), any of formulas (III-1) to (III-8), any of formulas (IV-1) to (IV-12), or any of formulas (V-1) to (V-4) can be suitably used as a negative resist. A photosensitive composition containing a heterocyclic compound represented by formula (II-1) or (II-2) can be suitably used as a positive resist. A photosensitive composition containing an alkali-soluble polymer having a phenol skeleton in its structure and a polymer having a nitrogen-containing heterocyclic compound as a polymeric unit is also included in this invention. The latter photosensitive composition can further contain a heterocyclic compound represented by any of formulas (VI-1) to (VI-15) described in the claims and specification.

This invention includes a photosensitive composition containing an alkali-soluble resin and a compound represented by formula (I), (II) or (III) described in the claims and the specification, a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (IV) described in the claims and the specification and a basic compound, and a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (VI) described in the claims and the specification and a compound which produces an acid upon radiation of light. A pattern formation method using these photosensitive compositions includes the steps of dissolving any one of the above photosensitive compositions in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, and developing the exposed resin layer with an aqueous alkaline solution. When the first or second photosensitive composition is used, a good pattern can also be formed by a method including the steps of dissolving either the first or second photosensitive composition in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, heating the pattern-exposed resin layer, exposing the entire surface of the heated resin layer, and developing the entirely exposed resin layer with an aqueous alkaline solution.

Alkali soluble phenol polymer photosensitive composition

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Yokohama, Japan

Hirokazu Niki