Mitsubishi Denki Kabushiki Kaisha

Hirokazu Miyagawa

Shinji Sato

Hisao Tanaka

Akaru Usui

The laser machining apparatus according to the present invention holds a plate-formed work W giving tension thereto, and comprises a driver base/a work base driving the work in the axial direction, a converging lens for a laser beam L, a laser machining head moving in a direction in which the laser beam L is focused onto the work, an upper work holding member having a nozzle for laser beam irradiation integrated thereto, a bellows for relatively and displaceably connecting the laser machining head and the upper work holding member in the focusing direction, and a lower fixed base/a highly slippery plate located and fixed at a position corresponding to a center of the nozzle, and the work is held between the upper work holding member and the lower fixed base/a highly slippery plate at a position adjacent to the laser beam machining position.

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Nagoya, Japan

Hirokazu Miyagawa