Nitto-denko Corporation

Sakura Color Products Corporation

Epistar Corporation

Hirokazu Matsuda

Takashi Kondo

Hiroyuki Katayama

Ryuichi Kimura

Hiroki Kono

Hiroshi Inoue

Tsuyoshi Inoue

Osamu Kondo

Yasunari Ooyabu

Hidetoshi Fukuo

Terukazu Ihara

Takeshi Omatsu

Hiromoto Haruta

Kazuhito Okumura

Ichiro Suehiro

Munehisa Mitani

Satoru Suzuki

Kazuaki Suzuki

Shinya Nishiyama

Koso Matsuda

Kensuke Tani

Haruka Ona

Yoko Muraoka

Provided is a carbon-dioxide capture and treatment system comprising: a carbon dioxide-enriched mixture gas generation device comprising a separation membrane capable of increasing a carbon dioxide concentration of a mixture gas taken therein, thereby generating a carbon dioxide-enriched mixture gas; a carbon dioxide conversion device configured to convert carbon dioxide in the enriched mixture gas received from the carbon dioxide-enriched mixture gas generation device, into a chemically stable compound; a final treatment device comprising an adsorbent, wherein the final treatment device is configured to adsorb the carbon dioxide by the adsorbent, thereby separating the carbon dioxide from other gas components; and a carbon dioxide direct capture device configured to take in air contained in an ambient environment, and supply the taken-in air to the final treatment device or an upstream side thereof in the carbon-dioxide capture and treatment system.

Carbon-dioxide capture and treatment system and carbon-dioxide negative emissions plant

A sheet used for coating an optical semiconductor element is used for directly or indirectly covering an optical semiconductor element, and includes a white layer containing white particles; and a light diffusion layer containing light-diffusing particles, in this order in a thickness direction.

Optical semiconductor element coating sheet

A transparent film, the back-face of which has excellent resistance to scratch and printability, and a surface protection film which has such a transparent film are provided. A transparent filmhas a substrate layerformed of a transparent resin material, and a back-face layerwith a thickness of 1 &#x3bc;m or less provided on a first faceA thereof. A percent change in coefficient of friction &#x394;&#x3bc; is less than 10% for the transparent filmwhen the percent change is determined from a coefficient of friction &#x3bc;of the back-face layer after being conserved at 50&#xb0; C. and 15% RH for three days and a coefficient of friction &#x3bc;of the back-face layer after being conserved at 80&#xb0; C. and 80% RH for three days, with an absolute value of difference between the two coefficients of friction |&#x3bc;&#x2212;&#x3bc;| being divided by the smaller value of the two coefficients of friction.

Transparent film and use thereof

An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 &#x3bc;m or more.

Encapsulating sheet, optical semiconductor device, and producing method thereof

An encapsulating sheet includes an encapsulating layer for encapsulating a light emitting diode element, a light scattering layer formed at one side in a thickness direction of the encapsulating layer and for scattering light emitted from the light emitting diode element, and a spacer layer interposed between the encapsulating layer and the light scattering layer.

Encapsulating sheet, producing method thereof, light emitting diode device, and producing method thereof

A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two silanol groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without having an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation retarder.

Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheet

The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.

Encapsulating sheet for optical semiconductor

An encapsulating sheet includes an encapsulating resin layer and a wavelength conversion layer laminated on the encapsulating resin layer. The wavelength conversion layer is formed by laminating a barrier layer formed of a light transmissive resin composition and having a thickness of 200 &#x3bc;m to 1000 &#x3bc;m, and a phosphor layer containing a phosphor.

Encapsulating sheet and optical semiconductor element device

The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 &#x3bc;m, a content of particles having a particle size of 1 &#x3bc;m or less of 15% by number or less and a content of particles having a particle size of 60 &#x3bc;m or more of 15% by number or less.

Composition for thermosetting silicone resin

The ink backflow preventive of the present invention contains at least refractory and/or involatile organic liquid substances and gelling agents, wherein the oil separation degree under the specific condition is prepared to be 1 to 15 %, in which as at least said gelling agents, styrene-based thermoplastic elastomer is contained and said styrene-based thermoplastic elastomer is composed of two or more of said styrene-based thermoplastic elastomer with the same molecular weight and with the different average molecular weight.

Ink backflow preventive for water-based ball-point pens

The invention provides a crayon comprising an organic solvent, a resin soluble in the organic solvent, a coloring agent, a gelling agent and an interferential pearl luster pigment. The crayon provides a metallic or pearly coating film, and has characteristics such that the color tone of the coating film varies with an angle for viewing the coating film, namely, a visual angle for the coating film. Therefore, for example, when applied to a flaw caused in metallic or pearly coating of automobiles, the crayon is adapted to such coating of automobiles to form an integrated coating film, so that it is suitably used for repairing such a flaw.

Growing community of inventors

Osaka, Japan

Hirokazu Matsuda