Daikin Industries, Ltd.

Greene, Tweed of Delaware, Inc.

Greene, Tweed Technologies, Inc.

Hirokazu Komori

Junpei Terada

Meiten Koh

Tatsuya Morikawa

Masaji Komori

Tsuyoshi Noguchi

Yuki Ueda

Takafumi Yamato

Hiroyuki Yoshimoto

Hiroyuki Hamada

Toshio Miyatani

Tadahiro Yabu

Tomohiro Shiromaru

Masahiro Kondou

Hiroyuki Sendan

Yukihiro Fukagawa

Kenta Murayama

Jiazhong Luo

Hideki Kono

Ayane Nakaue

Hirofumi Mukae

A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.

Fluororesin composition, fluororesin sheet, laminate and substrate for circuits

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board

A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 μm or more and 200 μm or less and a D10 of 12 μm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.

Molding powder

A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 &#x3bc;m or more and 200 &#x3bc;m or less, and the fluororesin has a D10 of 12 &#x3bc;m or more.

The present invention includes crosslinked perfluoroelastomeric compositions and molded articles formed from a cross-linkable perfluoroelastomeric composition having a first curable perfluoropolymer having a cure site monomer and a second perfluoropolymer having a cure site monomer. The molar ratio of the tetrafluoroethylene monomer to perfluoroalkylvinyl ether in one perfluoropolymer is about 0 to 100 to about 65 to 35 in the perfluoropolymer. The molar ratio of the tetrafluoroethylene monomer to the perfluoroalkylvinyl ether monomer in the second polymer is about 65:35 to about 95:5 in the second perfluoropolymer. The composition further includes a curative. One fluorine-containing elastomer composition herein, having a short crosslinking time, has perfluoroelastomers (A) having a tetrafluoroethylene unit, a perfluoralkylvinyl ether unit (a) and a monomer unit (b) having at least one kind selected from the group consisting of a nitrile group, a carboxyl group and an alkoxycarbonyl group, wherein the composition has two or more kinds of perfluoroelastomers (A) having differing contents of perfluoroalkylvinyl ether unit (a).

Perfluoroelastomer compositions and methods of preparing same

A fluorine-containing elastomer composition assuring a low compression set and comprising a perfluoroelastomer (A) comprising (a) 18 to 33% by mole of a perfluoro(alkyl vinyl ether) unit, (b) 0.3 to 0.6% by mole of a monomer unit having at least one selected from the group consisting of a nitrile group, a carboxyl group and an alkoxycarbonyl group and (c) a tetrafluoroethylene unit.

Fluorine-containing elastomer composition and sealing material made of same

Growing community of inventors

Settsu, Japan

Hirokazu Komori