Hitachi, Ltd.

Fujitsu Hitachi Plasma Display Limited

Other

Hitachi Maxell, Limited

Advanced Pdp Development Center Corporation

Hirokazu Inoue

Kazuji Yamada

Yuji Sano

Toyoshi Kawada

Tomokatsu Kishi

Akihiro Takagi

Hideo Arakawa

Akira Tanaka

Michitaka Ohsawa

Tadahiko Miyoshi

Kazuhiro Suzuki

Satoru Ogihara

Naohiro Momma

Kunio Miyazaki

Osamu Miura

Mamoru Sawahata

Hiroichi Shinohara

Hironori Kodama

Takashi Hosokawa

Masaki Fukuoka

Mutsuhiro Mori

Ryuichi Saito

Akio Takahashi

Mitsuo Usami

Satoshi Shimada

Yutaka Sugita

Akio Mukoh

Ken Takahashi

Akira Kato

Hideo Suzuki

Koichi Watanabe

Osamu Saito

Koji Sasaki

Fumiyuki Kobayashi

Tetsuo Nakazawa

Masahiro Nagasu

Akihiro Tamba

Shigeta Ueda

Shin Kimura

Hiroshi Yokoyama

Masahide Okamoto

Shunichi Numata

Tomoji Oishi

Jin Onuki

Atsushi Morihara

Isao Kobayashi

Keiichirou Nakanishi

Yoshiyuki Yasutomi

Yasutoshi Kurihara

Masaaki Takahashi

Yasuo Osone

Shinji Hiramitsu

Masahiro Takasaka

Kiyoshi Watanuki

Hideo Homma

Yoshio Naganuma

Katsunori Ouchi

Osamu Hirohashi

Yukio Akiyama

Yukio Kamita

Yoichi Abe

A plasma display apparatus including a capacitive load and a driving circuit is provided. The plasma display apparatus includes a driving power source supplying a drive voltage to the capacitive load and a reference potential terminal supplying a reference potential to the capacitive load. A drive IC is coupled to the driving power source.

Capacitive-load driving circuit and plasma display apparatus using the same

A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4&#xb1;0.05 mm&#x3c6;, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K.

Power semiconductor module

A capacitive-load driving circuit has a configuration in which a driving power supply source is connected to an output terminal via a driving device. The capacitive-load driving circuit has a power distributing circuit inserted between the driving power supply source and the driving device. Therefore, temperature rise (power consumption) in the capacitive-load driving circuit can be distributed.

Capacitive-load driving circuit capable of properly handling temperature rise and plasma display apparatus using the same

For a drive circuit of a sustaining discharge circuit of an AC plasma display panel, an idea of current flow parts arrangement is provided to reduce inductance. The configuration includes a plasma display panel on which electrodes are formed, an electric conductive conductor for fixing the panel, a pair of circuit boards fixed onto the conductor using a plurality of fixing members, ground terminals and electric power supplies disposed respectively for the circuit boards, and a pair of connecting circuit boards connected to end portions respectively of the circuit boards and an end portion of the panel. The ground terminals are electrically connected via fixing members to a position near an end portion of the conductor.

Plasma display apparatus

IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.

IC chip mounting structure and display device

A low-cost display driver module that shortens the process for connecting an integrated circuit chip and a wiring pattern on a flexible wiring board and uses a metal chassis on a display panel as a radiator. In this display driver module, an integrated circuit chip with bump electrodes on it is joined with pressure applied by the use of an anisotropic conductive film, an anisotropic conductive paste, a non-conductive resin paste, or a non-conductive resin film and the back of the integrated circuit chip is adhered to a metal chassis on a display panel by the use of an integrated-circuit chip adhesive. As a result, the metal chassis can be used as a radiator for the integrated circuit chip. Batch bonding will enable to shorten time for the connection process and to cut down the cost of installations. Furthermore, a radiator is unnecessary, resulting in a low-cost display driver module.

Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis

Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control electrode wirings from main electrode wirings are also given function of positioning of the respective semiconductor chips in the flat package. Further, a one-piece control electrode wiring net is housed in the common electrodes of the package and the electrodes which are led out from the control electrodes of the respective semiconductor chips are connected to the net to simplify the processing of a large number of gate signal wirings.

Flat semiconductor device and power converter employing the same

A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.

Semiconductor module

Integrated circuit devices, chips and methods of making and operating them are disclosed. The devices are specially adapted for high frequency operation e.g. at or above 1 GHz. Inductive noise caused by switching at these frequencies--and which can interfere with switching--is inhibited by using a large bypass capacitor connected between power and ground connections outside the chip, and a small bypass capacitor connected between the same power and ground connections but formed inside the chip. The smaller capacitor cuts noise attributable to the wiring between the larger capacitor and the chip. The chip can have many of the smaller capacitors, even one or more per gate. In the preferred embodiments, the small capacitors from power and ground bonding pads are formed at the front surface of the chip substrate. Tantalum pentoxide, and other suitable dielectrics having relative dielectric constant of 10 or more at 1 GHz, are used to form the capacitors.

Semiconductor integrated circuit devices including means for reducing

In a method of removing a component from a wiring board to which the component is attached by heat-softenable resin, the improvement is provided of, after softening of the resin by heat and removal of the component, removing residual resin remaining on the board at the location of the component by application of ultraviolet laser radiation having an intensity sufficient to decompose and disperse said residual resin. This can be done without damaging the wiring on the board so that the wiring is re-usable to attach a further electronic component at the same location. Excessive heating of the board can be avoided by measures such as applying a pre-load to the component during softening so that it moves when sufficiently softened, and monitoring the softening.

Method and apparatus for removing an electronic component from a board

An electronic parts loaded module comprises a circuit board having electronic parts connected thereto via a plurality of projecting electrodes, in which two or more of the plurality of projecting electrodes for connecting the electronic parts have a narrowed portion between one end adjacent to the boundary for connection with the electronic parts and the other end adjacent to the boundary for connection with the board, the narrowed portion having a cross-section which has different dimensions in crossing directions, or a minor axis and a major axis different in length from each other. The projecting electrodes are disposed in a manner as the larger dimension or the major axis being aligned along the periphery or the side of the electronic parts, or as surrounding the central area of the surface, on which the electronic parts are loaded. The module can be used in IC cards and liquid crystal display apparatuses and the like.

Electronic parts loaded module including thermal stress absorbing

An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

Mounting substrate

Noise generated at high frequencies at the time of simultaneous switchings of logical circuits is reduced by lowering an inductance from LSI to a capacitor formed on a substrate. The capacitor is formed to ensure that an inductance from a bonding pad for the LSI loaded on the substrate to an electrode of the capacitor is 0.05 nanohenry. The lower inductance from the LSI to the capacitor allows a reduction in the amount of the noise at high frequencies among those generated in power supply system, whereby the rising time of signals is made shorter, and the speed of arithmetic operation can be increased.

Capacitor-carrying semiconductor module

Growing community of inventors

Kawasaki, Japan

Hirokazu Inoue