Sharp Kabushiki Kaisha Corporation

Hirokazu Furukawa

Yoshimasa Chikama

Ryuji Matsumoto

A substrate of the present invention sequentially includes an insulating substrate, a lower layer, a first insulating film, a second insulating film, and an upper layer. The substrate is provided with a hole reaching at least one of the lower layer or the insulating substrate through at least the first insulating film and the second insulating film. The first insulating film includes in a region with the hole a protrusion that protrudes from an end portion in contact with the first insulating film of the second insulating film. The substrate includes a stepwise structure including the protrusion and the end portion. The upper layer coats the stepwise structure. An upper surface portion of the first insulating film in a region with the protrusion and an upper surface portion of the first insulating film in a region below the end portion of the second insulating film are coplanar.

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Sakai, Japan

Hirokazu Furukawa