Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Dow Toray Co., Ltd.

Hiroji Enami

Yoshitsugu Morita

Tomoko Kato

Masayuki Onishi

Masayoshi Terada

Takeaki Saiki

Tadashi Okawa

Makoto Yoshitake

Shoji Akamatsu

Yuji Hamada

Takeshi Imai

Akihiro Nakamura

Koji Nakanishi

Masaaki Amako

Harumi Kodama

Hidekatsu Hatanaka

Katsutoshi Mine

Minoru Isshiki

Hiroshi Ueki

Brian Harkness

Hiroshi Fukui

Satoshi Onodera

Ann Walstrom Norris

Junji Nakanishi

Shinichi Yamamoto

Manabu Sutoh

Michelle R Cummings

Tammy Cheng

Masashi Murakami

Atsushi Togashi

Takahiro Sato

Malinda Howell

Yoshitsuga Morita

Masakazu Irie

A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25&#xb0; C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0&#xd7;10to 1.0&#xd7;10dyne/cm, a complex elastic modulus of from 5.0&#xd7;10to 1.0&#xd7;10dyne/cm, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.

Silicone gel composition

A silicone gel composition comprising: (A) branched organopolysiloxane having, on average, at least two alkenyl groups bonded to silicon atoms in a molecule, and a viscosity ranging from 10 to 10,000 mPa&#xb7;s at 25&#xb0; C.; (B) organohydrogenpolysiloxane; (C) platinum-based addition reaction catalyst; and (D) a reaction product of (d1) alkali metal silanolate with (d2) at least one ceric salt selected from cerium chloride and a carboxylic acid salt of cerium.

Silicone gel composition and use thereof

A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si&#x2014;H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

Method of manufacturing a layered silicone composite material

A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: RSiO(RSiO)SiR(where Ris a monovalent hydrocarbon group, and 'm' is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (RSiO)(RSiO)(RSiO)(where Ris a monovalent hydrocarbon group, and 'a', &#x201c;b&#x201d;, and &#x201c;c&#x201d; are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

Curable organopolysiloxane composition and semiconductor device

A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiOunits, RRSiOunits, and RSiOunits, wherein Ris an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and Ris an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.

Curable silicone composition

A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Curing silicone composition and cured product thereof

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

Semiconductor device and method of manufacturing thereof

A room-temperature-curable organopolysiloxane composition comprising:

Room-temperature-curable organopolysiloxane composition

A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Heat-conductive silicone composition

A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.

Growing community of inventors

Chiba, Japan

Hiroji Enami