Sony Corporation

Sony Group Corporation

Sony Semiconductor Solutions Corporation

Hirohito Miyazaki

Tsuyoshi Ogawa

Kazuyoshi Yamada

Hirokazu Nakayama

Bernadette Elliott-bowman

Fujio Kanayama

Timothy Beard

Namiko Takeshima

Yuji Nishida

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

Substrate and semiconductor package

There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.

Optical-electrical hybrid module

An optical communication fiber includes: a fiber body having a tip surface; and a light absorption layer provided to the tip surface of the fiber body, and configured to reduce light transmittance of communication light.

Optical communication fiber, optical communication module, and optical communication system

A hybrid module includes a silicon substrate having a plurality of part mounting openings formed therein, the plurality of part mounting openings composed of through holes, a plurality of mounted parts that are mounted in the part mounting openings such that input/output portion forming surfaces are substantially flush with a first main surface of the silicon substrate, a sealing layer that is formed of a sealing material filled into the part mounting openings and covers the mounted parts, with the input/output portion forming surfaces exposed from the first main surface of the silicon substrate, to fix the mounted parts in the part mounting openings, and a wiring layer that is formed on the first main surface of the silicon substrate, and has a wiring pattern connected to input/output portions that are provided on the input/output portion forming surfaces of the mounted parts exposed from the first main surface.

Hybrid module and method of manufacturing the same

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Kanagawa, Japan

Hirohito Miyazaki