Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Works, Ltd.

Panasonic Corporation

Hirohisa Hino

Yasuhiro Suzuki

Naomichi Ohashi

Taro Fukui

Honami Nawa

Hidenori Miyakawa

Masato Mori

Arata Kishi

Kenji Kitamura

Atsushi Yamaguchi

Shinji Hashimoto

Koso Matsuno

Shigeru Yamatsu

Yuki Yoshioka

Takayuki Higuchi

Honami Nishino

Naoki Kanagawa

A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure

A resin flux solder paste includes a solder powder, and a flux, in which the flux contains at least an epoxy resin, a curing agent, a curing accelerator, and an activator, the epoxy resin contains 10% to 90% by weight of one or more of a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, and a dicyclopentadiene type epoxy resin, having an epoxy equivalent of 200 to 400, with respect to a total amount of the epoxy resin, and the curing agent contains 30% to 95% by weight of a biphenyl aralkyl phenol resin having a hydroxyl group equivalent of 150 to 350 with respect to a total amount of the curing agent, and 5% to 70% by weight of a phenol novolac resin having an allyl group having a hydroxyl group equivalent of 100 to 200 with respect to the total amount of the curing agent.

Resin flux solder paste and mount structure

A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.

Resin composition, and electronic component and electronic device using same

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Resin fluxed solder paste, and mount structure

Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 &#x3bc;m to 20 &#x3bc;m; and a filler having a grain diameter of 15 &#x3bc;m or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 &#x3bc;m to 20 &#x3bc;m.

Heat-dissipating resin composition, and component and electronic device including the same

A mounting structure, including: a first component that has a first bump; a second component that has a second bump; a mounting component that has a primary mounting surface and a secondary mounting surface; a first solder that connects an electrode on the primary mounting surface and the first bump; a second solder that connects an electrode on the secondary mounting surface and the second bump; and a reinforcing resin that covers a part of the first solder and that is not in contact with the primary mounting surface.

Mounting structure and method for producing mounting structure

Provided herein is a resin structure having high heat dissipation, and desirable adhesion at the interface with a heat generating device. The resin structure is provided on a substrate to dissipates heat of the substrate to outside, and includes: a water-based coating material layer provided on the substrate and including a water-based coating material, and fillers having an average particle size of 30 &#x3bc;m to 150 &#x3bc;m; and a resin layer provided on the water-based coating material layer and containing a thermosetting resin. The fillers have a far-infrared emissivity of 0.8 or more, and an average aspect ratio of 1 to 12 as measured as a ratio of lengths along the long axis and the short axis through the center of gravity of the fillers. At least 80% of the total number of fillers has a length that is at least 1.7 times longer than the total thickness of the water-based coating material of the water-based coating material layer and the thermosetting resin of the resin layer, as measured along the long axis through the center of gravity of the fillers.

Resin structure, and electronic component and electronic device using the structure

A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity &#x3bb; of the heat conduction layer is 1.0 W/(m&#xb7;K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity &#x3b5; of the heat radiation layer is 0.7 or more.

Cooling structure

The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, Rto Rare each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond &#x3c0; electrons and is capable of coordinating with a metal.

Thermosetting resin composition, method of manufacturing the same and circuit board

Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.

Composition of cyanate ester, epoxy resin and acid anhydride

Seal coating mask for semiconductor element and method of use thereof with a seal coating mask with an opening located at a position where a semiconductor element is mounted on a wiring board. The coating mask has an annular protrusion formed along the whole periphery of the opening. A clearance of about 0.01 to 0.5 mm is formed between at least a part of the whole periphery of the annular protrusion and the front surface of the wiring board. The coating mask also includes a space portion formed on the back of the seal coating mask for cutting off cooling material outside of the annular protrusion. The coating mask is used to forcibly coat a material for sealing the semiconductor element in the front surface of the wiring board.

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Osaka, Japan

Hirohisa Hino