Citizen Electronics Co., Ltd.

Citizen Watch Company, Ltd.

Citizen Holdings Company, Ltd.

Hirohiko Ishii

Koichi Fukasawa

Sadato Imai

Masahide Watanabe

Koki Hirasawa

Junji Miyashita

Mitsunori Ishizaka

Norikazu Kadotani

Masakazu Koizumi

Shingo Mizuguchi

Tatsuji Hirano

Yuji Omori

Kenji Imazu

Atsushi Nishida

Masahiko Hamada

A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, the light being a mixture of light emitted from a plurality of light-emitting elements mounted densely and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, a plurality of light-emitting elements mounted densely on the board, a first resin free from any phosphor, placed among the plurality of light-emitting elements, and a second resin containing a phosphor and covering an exposed part of the plurality of light-emitting elements.

Light emitting device and manufacturing method thereof

A light-emitting device is provided whose color mixing property and light emission efficiency are improved, while white light with high color rendering performance is ensured by means of four kinds of LED elements emitting red, green, blue, and white light respectively. The light-emitting device includes a phosphor layer containing a phosphor, a first LED element to emit white light in combination with fluorescence generated by excitation of the phosphor, a second LED element to emit red light, a third LED element to emit green light, a fourth LED element to emit blue light placed more distant from the phosphor layer compared to the second and third LED elements, a substrate with the first to fourth LED elements mounted on a common mounting surface, a resin frame surrounding at least a part of an outer circumference of the substrate, a sealing resin injected inside the resin frame and on the substrate to encapsulate the first to fourth LED elements, and a light-shielding component placed on an upper surface of the sealing resin to cover at least the first LED element.

Light-emitting device

A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as possible from a designed hue value, wherein the light is a mixture of light emitted from densely-mounted light-emitting elements and excited light from a phosphor contained in a resin sealing the light-emitting elements. The light-emitting device includes a board, light-emitting elements mounted densely on the board so that light-emitting surfaces thereof face opposite to the board, and a seal resin containing a plurality of different phosphors and covering all of the light-emitting elements, wherein the phosphors are excited by light from the light-emitting elements and deposited on upper surfaces of the light-emitting elements. A space between adjacent light-emitting elements has a length of 5 &#x3bc;m or more and 120% or less of a median diameter D50 of a phosphor which has the largest average particle size of the phosphors.

An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.

LED package, light emitting device and method for manufacturing LED package

Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.

LED module and LED lamp employing same

A method for manufacturing a semiconductor light emitting device comprises steps of: arraying semiconductor light emitting elements on an adhesive sheet so that electrodes of the semiconductor light emitting elements face the adhesive sheet; forming a wafer thereof by filling spaces between side surfaces of the semiconductor light emitting elements arrayed on the adhesive sheet with a resin and curing the resin; peeling the adhesive sheet from the wafer; overlaying the wafer on a substrate from which numerous substrates can be obtained by subdivision into individual pieces and the electrodes of the semiconductor light emitting elements and electrodes formed on the large circuit substrate are joined; and subdividing the large circuit substrate, to which the wafer has been joined, into individual semiconductor light emitting devices so that the planar size of the semiconductor light emitting element and that of the circuit substrate are roughly equal.

Semiconductor light emitting device and method for manufacturing same

An illumination device includes a circuit board (), an LED element () mounted on the circuit board, a light-transmitting sealing resin () covering the LED element and containing a fluorescent material, a light reflector () covering the light-transmitting sealing resin and reflecting light emitted from the LED element, and a light-guiding part () comprising a light-transmitting plate connected to the light-transmitting sealing resin, the light-guiding part guiding the light emitted from the LED element and including a light emission surface () configured to emit the light.

Illumination device and method for manufacturing the same

A semiconductor light-emitting device includes: a printed-wiring board; a light-emitting diode element mounted on the printed-wiring board; and a resin body for sealing the light-emitting diode element. The resin body is composed of a first resin body arranged around the light-emitting diode element, and a second resin body, which seals the light-emitting diode and the first resin body. An upper edge of the first resin body disposed at a lower position of the PN-junction is configured to be at least on or beyond an imaginary line that connects the PN-junction and a lower edge of the second resin body.

Semiconductor light-emitting device

A plurality of LEDs are mounted on a substrate aggregation, a transparent layer is formed on the substrate aggregation. The transparent layer between adjacent divisions is removed to form an individual transparent layer and to form a groove around the individual transparent layer. The groove is filled with a reflector material to form a reflector layer. The reflector layer and the substrate are cut so as to form a reflector film on the outside wall of the individual transparent layer, thereby forming a plurality of LED devices.

Light emitting diode device for illumination objects

A surface-mounted LED including a base having heat conductivity, an insulative wiring board fixed to the base and including a conductive pattern and a mounting hole, a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board, and a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip, heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.

Surface-mounted LED and light emitting device

Light emitting diode

A method for manufacturing light emitting diode device by mounting an LED on a substrate, providing electrodes to connect the substrate to the LED for applying a current to the LED, encapsulating the LED with an encapsulating resin, measuring chromaticity of light emitted from the encapsulated LED, calculating a correcting chromaticity necessary for correcting the measured chromaticity of the light from the encapsulated LED to a desired chromaticity, preparing filter agents for the correcting chromaticity of light from the encapsulated LED and applying the adjusted filter agents to the surface of the encapsulating resin.

Method for manufacturing a light emitting diode device

An elastic connector integrated with electrodes on at least either a chip-type LED or a circuit board facing each other is sandwiched and compressed by the chip-type LED and the circuit board so as to provide an electric connection. The thus obtained integrated connector is thin and cost-effective while able to provide a secure conductivity between the electrodes of the printed circuit board and the chip-type LED in a simple connection method, and a LED including the integrated connector also is provided.

Connector integrated with a LED element

Method for manufacturing an elastic connector, integrated with an electrode of at least either a chip-type LED or a printed circuit board on which a LED element is directly mounted and to which the LED is electrically connected. The LED-integrated connector can subsequently be mounted on another circuit board by being sandwiched and compressed between a lower surface of the chip-type LED or lower surface of the LED-mounted printed circuit board and the other circuit board to which the LED-integrated connector is being mounted, so as to provide an electric connection. The method providing a LED-integrated connector which is thin and cost-effective while able to provide a simple and secure conductivity between electrodes of the chip-type LED and other circuit board, to which the LED-integrated connector is subsequently mounted.

Growing community of inventors

Fujiyoshida, Japan

Hirohiko Ishii