Kaken Tech Co., Ltd.

Hirohiko Furui

Shigeo Hori

Hiroki Nakatsukasa

Akira Fujita

Hisakazu Takahashi

Tadashi Kubota

Yoshiaki Kubota

Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 &#x3bc;m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2&#x3b8;=38&#xb0;&#xb1;0.2&#xb0; in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2&#x3b8;=38&#xb0;&#xb1;0.2&#xb0; in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250&#xb0; C., 60 minutes) of the silver particles is designated as S2, the value of S2/S1 is adjusted to a value within the range of 0.2 to 0.8.

Conductive paste and die bonding method

Provided are a flaky-like silver powder having a low bulk density as well as a predetermined average particle size (D) and the like, which is obtainable by using a predetermined wet reduction method, a conductive paste obtainable using such a flaky-like silver powder, and a method for producing such a flaky-like silver powder. Disclosed are a flaky-like silver powder obtainable by a wet reduction method, a conductive paste obtainable using a flaky-like silver powder, and a method for producing a flaky-like silver powder, in which the average particle size (D) as an equivalent circle diameter obtainable when the flaky-like silver powder particles are viewed planarly is adjusted to a value within the range of 1.1 to 30 &#x3bc;m, the thickness of the flaky-like silver powder particles is adjusted to 0.01 to 2 &#x3bc;m, and the bulk density of the flaky-like silver powder is adjusted to a value within the range of 0.1 to 4 g/cm.

Flake-like silver powder, conductive paste, and method for producing flake-like silver powder

The present invention provides an Ag or Ni conductive powder, which can show the high conductivity even in condition that a resin is included and can has the narrow particle size distribution, and a conductive composition using the same, and a producing method of the same. In such an Ag or Ni conductive powder, a conductive composition and a producing method of the conductive powder, the conductive powder having a convex radially extended and a concave, wherein a core material which is at least one particle selected from the group consisting of an organic type particle, a metal type particle and a ceramic type particle is included into the conductive powder.

Conductive powder, conductive composition, and producing method of the same

The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of the glycol compound falls within a range of 1 to 40 weight % with respect to a total amount of the cleaning agent for removing the solder flux. The cleaning agent for removing the solder flux is used for cleaning the lead-free solder flux and the high-melting-point solder flux or the like.

Growing community of inventors

Shiga, Japan

Hirohiko Furui