Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Hiroharu Kamiyama

Shigeharu Arike

Yasushi Shimada

Toshiro Okamura

Yorio Iwasaki

Eisaku Namai

Fujio Kojima

Akishi Nakaso

Haruo Ogino

Tamotsu Ueyama

Yukihiko Wada

Masaji Homma

Hitoshi Aisawa

Tatsuhisa Shibata

Takayoshi Komatsu

A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.

Process for producing coaxial conductor interconnection wiring board

A circuit board having holes (a) and holes (b) therein with different electrically connecting structures and enlarged connecting areas with respect to an insulating substrate and circuit conductors formed on the insulating substrate is excellent in connection reliability and high in wiring density.

Wiring board and process for producing the same

A coaxial conductor interconnection wiring board includes at least one coaxial conductor and at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor. The conductive shield of the coaxial conductor is connected to the ground layer by connection metal layers. A conductor insulating layer surrounds the metallized conductor hole and the connection metal layers surround a part of the additional conductor insulating layer. Thus, the conductive hole, insulating layer, and connection metal layers function as a coaxial conductor.

Coaxial conductor interconnection wiring board

A novel circuit board in which circuit portions including pad portions, through-hole portions and conductors are formed, at least at the pad portions and the through-hole portions of the circuit, in the vacant portions defined by a cured photopolymeric resin composition and the vacant portions are plated with electroless copper. When only the pad portions and through-hole portions are plated with electroless copper, the conductors are all covered with the resin composition, thereby enabling fears of mechanical and chemical damages to be eliminated. When all the circuit portions are plated with electroless copper, the amount of copper required can be considerably reduced. Such circuit board is prepared by applying onto a laminate with or without copper clad thereon a specific photopolymerizable resin composition, irradiating the resin composition-applied laminate with ultraviolet rays through a pattern mask, treating the thus irradiated laminate with a solvent to remove the unexposed portions of resin composition and applying an electroless copper plating to the unexposed portions. A durable and reliable printed circuit board having a high pecision and high density circuit pattern can be provided very simply, easily at low cost.

Method of making printed circuit board

Growing community of inventors

Shimodate, Japan

Hiroharu Kamiyama