Nitta Corporation

Hirofumi Tsujimoto

Toshiharu Shimai

Tomohisa Shimada

An IC tag according to the present invention includes: an IC chip (); a dipole antenna () for electrically transmitting and receiving information stored in the IC chip (); and a sheet-shaped substrate () that supports the IC chip () and the dipole antenna (). In this IC tag, 0.1≤R/L≤2.5 is satisfied, where R is a resistance value between two ends (S, S) of the dipole antenna () and L is a length of a path that connects the two ends (S, S) of the dipole antenna () while extending along the dipole antenna () without passing through the IC chip ().

IC tag

Provided are a wiper for a machine tool and a method for manufacturing a wiper for a machine tool, which can simplify a manufacturing process. A wiper for a machine tool mountable on a machine tool includes: a wiper body fixable to the machine tool, and made of a first elastic material having hardness of 80 degrees or more; and a sliding part made of a second elastic material containing a particulate reinforcing material and having hardness in a range of 50 degrees or more and 90 degrees or less which is smaller than the hardness of the first elastic material, the sliding part being provided integrally with the wiper body, wherein the wiper body and the sliding part are integrally formed without an adhesive.

Machine tool wiper and method for manufacturing machine tool wiper

An IC tag according to the present invention includes: a sheet-shaped tag main body having an outer shape that extends in a lengthwise direction and a widthwise direction orthogonal to the lengthwise direction; and a reinforcing member that is arranged along the widthwise direction so as to cover a surrounding area of the tag main body. The tag main body includes: an IC chip; an antenna configured to electrically transmit and receive information stored in the IC chip; and a sheet-shaped substrate that supports the IC chip and the antenna. The reinforcing member is made of a material having a Shore D hardness that is less than or equal to a Shore D hardness of the substrate, and is arranged so as to cover at least the IC chip.

Growing community of inventors

Yamatokooriyama, Japan

Hirofumi Tsujimoto