Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hirofumi Tajika

Masaya Nakatani

Koji Nomura

Kazunari Nishihara

Michihiko Hayashi

Motoyuki Toji

Yoshihiro Tomita

Satoshi Ouchi

Motoyuki Taji

Osamu Kawasaki

Shigeo Suzuki

Toshiyuki Nozoe

Takeo Yasuho

Hidenobu Shintaku

Katsumasa Miki

Masahiro Nagasawa

Katsuya Morinaka

Tsutomu Nakanishi

Hiroshi Fukushima

Katsumi Kohzu

The drop impact measuring system has i) a plurality of bimorph-type acceleration sensor containing a plurality of free vibrating sections each of which has individual draw-out electrodes; ii) a switch section for selecting output from the bimorph-type acceleration sensors; iii) an amplifying circuit for amplifying a signal applied via the switch section from the acceleration sensors; and iv) a logic circuit for logically evaluating the output from the amplifying circuit and controlling the switch section according to the result acquired from the logical evaluation.

Drop shock measurement system and acceleration sensor element used in the same

An angular velocity sensor includes a tuning-fork-shaped substrate (), drivers () that are provided on the arms forming a tuning fork and vibrate the arms; monitors () for detecting vibrations generated by the drivers (); and detectors () for detecting displacement of vibrations made in application of an angular velocity. The drivers (), the monitors (), and the detectors () are made of a lower electrode layer, a piezoelectric thin film, and an upper electrode layer formed on the arms. The outer peripheral edge of the piezoelectric thin film is shaped like a step having at least one flat portion. The flat portion along the outer peripheral edge has no upper electrode layer formed thereon. This structure prevents short circuits between the lower electrode layer and the upper electrode layer.

Angular-velocity sensor

A piezoelectric member and an electrode are formed over a silicon substrate. The piezoelectric member and the electrode are patterned by photolithography. The silicon substrate is etched to form a body. A protective film is formed on at least one surface of the body. Another surface having no protective film thereon is etched to obtain a resonant device. The body is etched in its thickness direction accurately while a resonance frequency of the body is measured. The manufacturing processes allow the resonance frequency and a gap frequency of the resonant device to be adjusted to predetermined values.

Method for manufacturing resonant device

A micro-transfer device for fine positioning is employed typically in recording and playback apparatus for recording disks. Voltage is stably supplied to an expandable element which displaces the position of a recording head by applying voltage. An end different from one end connected to a base, where the recording head is mounted, is fixed to a fixing substrate for preventing changes in dimensions of the expandable element. An external electrode connection for supplying voltage to the expandable element is provided in an area on the fixing substrate.

Micro-moving device and its manufacturing method

A thin film micromechanical resonator (resonator) having improved drive efficiency, a resonator gyro having improved sensitivity in detecting an angular velocity, and a navigation system and an automobile using the resonator gyro. The resonator includes a tuning fork structure made of a non-piezoelectric material, and a first electrode and a second electrode disposed respectively at the inner side and the outer side of the tuning fork arm. On the first and second electrodes, a first piezo film and a second piezo film are provided respectively, and a third electrode and a fourth are respectively provided electrode thereon. When an alternating voltage is applied to the third and fourth electrodes at the opposite phases each other, the tuning fork resonates in the direction perpendicular to the center line. The resonator gyro detects, at the sensing section which is formed of another electrodes and another piezo film, the Coriolis force generated in proportion to angular velocity given to the resonator.

Thin-film micromechanical resonator, thin-film micromechanical resonator gyro, and navigation system and automobile using the resonator gyro

An electronic circuit is manufactured by the following method. Elements are formed on a front surface of a substrate, and then, a recess is formed around each of the elements in the front surface of the substrate. Then, a portion of the substrate is removed from a back surface of the substrate until reaching the bottom of the recess. In the method, the elements are separated at once by removing the portion of the substrate from the back surface, and thus, the elements are manufactured efficiently.

Method for manufacturing electronic component

An angular velocity sensor, which is able to reduce the variations of driving resonance frequency of the vibrator and to improve the reliability of the sensitivity of detection signal with respect to the angular velocity applied, is provided. The angular velocity sensor comprises a vibrator, and a tuning-fork as the vibrator is formed of a silicone substrate with crystal orientation (100) as its main face, and a side face nearly perpendicular to the driving direction (X direction) of the arm of the tuning-fork corresponds to a crystal orientation where the elastic modulus is less dependent on azimuth angle.

Angular velocity sensor

An electronic apparatus is provided that comprises a shock detector for detecting a shock received by an electronic apparatus such as a portable telephone, a controller for comparing the value of the shock as detected by the shock detector with a reference value, and a memory element for storing an identifying signal generated when the value of a shock has exceeded the reference value and the value of shock. This enabling easy determination as to whether or not a breakdown has been caused by shock.

Electronic apparatus and method of detecting shock given to the electronic apparatus

The present invention relates to a method of manufacturing a piezoelectric device of high sensitivity using direct bonded quartz plate. To achieve this object, the invented method comprises the steps of covalently bonding a plurality of quartz plates, dry etching the bonded quartz plates with plasma from one side of its surfaces down to a bonded plane, and dry etching with plasma thereafter from the other side of the surfaces.

Method of manufacturing piezoelectric device using direct bonded quartz plate

An acceleration sensor having a well controlled dispersion in the detection characteristics and improved detection characteristics in the low frequency detection comprises a first piezoelectric plate ( ), a second piezoelectric plate ( ) bonded to the first piezoelectric plate ( ) by direct bonding, a first external electrode ( ) provided on the main surface of the first piezoelectric plate ( ) and a second external electrode ( ) provided on the main surface of the second piezoelectric plate ( ). The first piezoelectric plate ( ) and the second piezoelectric plate ( ) are bonded together with their polarization axes reversed to each other. Appearance of the acceleration sensor resembles to a letter &ldquo;L&rdquo; in the cross section; thickness of the supporting section ( ) is greater than that of the rest part (free vibration section).

Acceleration sensor and acceleration apparatus using acceleration sensor

An acceleration sensor having a well controlled dispersion in the detection, characteristics and improved detection characteristics in the low frequency detection comprises a first piezoelectric plate ( ), a second piezoelectric plate ( ) bonded to the first piezoelectric plate ( ) by direct bonding, a first external electrode ( ) provided on the main surface of the first piezoelectric plate ( ) and a second external electrode ( ) provided on the main surface of the second piezoelectric plate ( ). The first piezoelectric plate ( ) and the second piezoelectric plate ( ) are bonded together with their polarization axes reversed to each other. Appearance of the acceleration sensor resembles to a letter &ldquo;L&rdquo; in the cross section; thickness of the supporting section ( ) is greater than that of the rest part (free vibration section).

Protrusions made of an electrically conductive material such as a metal or ceramic are formed around a node point or a node line of vibrations of a piezoelectric plate on two principal planes thereof by a spraying process. The piezoelectric plate is held at the protrusions with leaf springs on the two principal planes. Thus, protrusions of a small surface area are formed without deteriorating the piezoelectric plate. The piezoelectric plate can be held stably without deteriorating the vibration characteristics. An alternating voltage is applied to electrodes of the piezoelectric plate through the electrically conductive protrusions. Because a spraying process is used, the protrusions can be thickly and precisely formed in a small area and held surely and reliably, with a good mechanical strength of the protrusions.

Holding structure for a piezoelectric vibrator

It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.

Growing community of inventors

Osaka, Japan

Hirofumi Tajika