Murata Manufacturing Co., Ltd.

Hirofumi Sunahara

Hiroshi Takagi

Sadaaki Sakamoto

Masachika Takata

Yasutaka Sugimoto

Mitsuyoshi Nishide

Hiromichi Kawakami

Kazuo Kishida

Hideyuki Harada

Yukio Sakabe

Shizuharu Watanabe

Hideaki Nakai

Toshiki Tanaka

Takahiro Matsumoto

Kimihide Sugou

Yoshiteru Aoi

Yuji Aso

A microorganism culture apparatus includes a three-layer stacked structure having a layered culture unit () that cultures a microorganism, a layered nutrient supply unit () that is arranged on a first surface () of the culture unit () and supplies a nutrient to the culture unit (), and a layered environmental component supply unit () that is arranged on a second surface () and supplies an environmental component to the culture unit ().

Microorganism culture apparatus and microorganism culture method

A consumable product having an anti-gram-negative bacterial compound with the amino acid sequence represented by the chemical formula below. Also described is a consumable product havingcapable of producing a compound having the sequence represented by the chemical formula below. Themay beMT2 strain (accession number: NITE BP-02767). Also described are methods of treating enteritis by administering a product as described herein to a patent in need thereof.

Anti-gram-negative bacterial compound

The present invention aims to provide an antimicrobial and antiviral agent which comprises a naturally occurring component as an active ingredient and is effective against microbes including various classes of fungi and viruses. In one aspect of the present invention, provided is an antimicrobial and antiviral agent comprisingderived fromvar.

Antimicrobial and antiviral agent, antimicrobial and antiviral member, and method for producing antimicrobial and antiviral agent

A piezoelectric actuator that includes (a) a piezoelectric body made of piezoelectric ceramic, the piezoelectric body having two principal surfaces facing each other and having four side surfaces, (b) external electrodes on the principal surfaces, (c) recessed portions in the four side surfaces, and (d) a coating layer made of resin and provided on the four side surfaces. The coating layer covers the recessed portions in the four side surfaces.

Piezoelectric actuator, method for manufacturing the same, and magnetic disc apparatus

A method for manufacturing a multilayer ceramic substrate includes a firing step wherein low-temperature-sinterable ceramic material contained in green base layers and inorganic material contained in green constraining layers chemically react each other, whereby a reaction layer is formed along an interface between the green base layer and the green constraining layer. The reaction layer acts to enhance a bonding force between the green base layer and the green constraining layer.

Multilayer ceramic substrate, method for manufacturing the same, and electronic device

A method for fabricating a multilayer ceramic substrate having a cavity with multi-steps therein for mounting an electronic component is provided. A block is inserted into a lower cavity segment of the cavity formed in a green sheet laminate to be the multilayer ceramic substrate, wherein the block has substantially the same three-dimensional shape as that of the cavity segment and has a height equal to or larger than the depth of the cavity segment. Thus, the pressing step is performed in a state such that the cavity has an apparent single step.

Method for producing multilayer ceramic substrate

In a ceramic green-sheet stack to be fired to form a multilayered ceramic substrate having a cavity, a shrinkage-reducing pad is formed along a boundary interface between first ceramic green sheets having an opening for defining a cavity, and second ceramic green sheets having no opening. The shrinkage-reducing pad is exposed on the entire periphery of the inner peripheral surface of the cavity at the bottom end of the inner peripheral surface. The shrinkage-reducing pad contains a glass component, and serves to reduce shrinkage stress produced at the boundary interface between the first and second ceramic green sheets during the firing process.

Multilayered ceramic substrate and production method therefor

The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the second constraint layer, and the first constraint layer is provided on one major surface that is more largely contracted by firing.

Method for manufacturing ceramic substrate and non-fired ceramic substrate

A composite monolithic electronic component has a laminate including a base layer having a relative dielectric coefficient of about 10 or less and a functional layer which is at least one of a high-dielectric-coefficient layer having a relative dielectric coefficient of about 15 or more and a magnetic layer. The base layer contains a crystallized glass containing SiO , MgO, Al O and B O , and a ceramic oxide having a thermal expansion coefficient of about 6.0 ppm/&deg;C. or more. The functional layer contains an amorphous glass having a softening point of about 800&deg; C. or less.

Composite monolithic electronic component

A glass ceramic multilayer circuit board uses Ag as a conductive material, in which oxidation and diffusion of silver are suppressed. The glass ceramic multilayer circuit board is formed by stacking glass ceramic layers and conductor layers, and then simultaneously burning the layered product. The glass ceramic layers are made of a glass ceramic insulating material which is composed of a glass component and a ceramic component, and to which a metal powder of Cu, Ni or the like is added.

Glass ceramic board

The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body-with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the second constraint layer, and the first constraint layer is provided on one major surface that is more largely contracted by firing.

A ceramic substrate composition includes about 26 to 48% by weight of a CaO&mdash;Al O &mdash;B O &mdash;SiO type glass, about 35 to 68% by weight of at least one of alumina, mullite, cordierite and forsterite, and about 3 to 24% by weight of quartz, said glass being capable of being crystallized to wollastonite by firing of the composition at a temperature of about 800 to 1000&deg; C. A ceramic circuit component contains a circuit formed on the ceramic substrate obtained by firing the composition.

Ceramic substrate composition and ceramic circuit component

Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100&deg; C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as &frac12; and a thermal expansion coefficient of as high as 12 ppm/&deg; C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO,, MgO and CaO, the composition ratio of SiO,, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.

Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board

A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated ceramic green sheets containing a ceramic insulating material and wiring conductors and preliminarily providing spaces in the inside such that the compact blocks fit into the spaces, arranging sheet type bases made from a raw ceramic not sintered at the baking temperature of the composite laminated member on the principal plane at both ends with respect to the lamination direction of the raw composite laminated member, baking the raw composite laminated member with the raw composite laminated member interposed by the sheet type bases so as to restrain the contraction at a temperature not more than about 1000&deg; C., and eliminating the unsintered sheet type bases.

Method of producing a multi-layer ceramic substrate

An inorganic composition for low temperature firing comprising about 15 to 40 weight % of glass powder and about 60 to 85 weight % of cordierite, is disclosed. The glass powder is composed of about 20 to 60 weight % of SiO,, about 30 to 50 weight % of B,O,, about 5 to 30 weight % of MgO, 0 to about 15 weight % of Al,O,, and about 1 to 5 weight % of R,O (R is alkali metal). The inorganic composition is capable of being fired at a relative low temperature, and has a low thermal expansion coefficient and permittivity, as well as high mechanical strength.

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Moriyama, Japan

Hirofumi Sunahara