Nec Corporation

Hirofumi Seo

Hidemitsu Aoki

Yoshimi Shiramizu

Masaharu Nakamori

Haruto Hamano

Shinichi Hiramatsu

Yasushi Sasaki

Yuji Shimizu

Hiroshi Kitajima

Makoto Morita

Kaori Watanabe

Nahomi Ohta

Makoto Iuchi

An image processing device includes a UI controller and a rendering processor. The rendering processor obtains, from volume data constituted by multiple points, each point having a value, surface data representing the shape of a surface. The shape of the surface is defined by magnitude of each of the values. The UI controller sets a threshold for the values to determine whether to display the surface data. The rendering processor determines an intersecting point at which a straight line passing through a position set as a viewpoint and a point specified by a user intersects with the shape of the surface which is to be displayed in accordance with the threshold. Based on a plane passing through the intersecting point, the rendering processor controls the displaying of the shape of the surface represented by the surface data.

Image processing device, image processing method, and storage medium for controlling the display of the shape of the surface represented by surface data

A semiconductor device manufacturing machine comprises a mechanism provided in a processing chamber, for lifting up a ring-like peripheral member, and a holder provided at a tip end of a feeding mechanism located in a feeding chamber, and capable of holding either or both a semiconductor wafer and the ring-like peripheral member, so that, in the processing chamber maintained in a vacuum condition, the ring-like peripheral member is lifted up by the lifting mechanism and transferred to the holder of the feeding mechanism, and the ring-like peripheral member held by the holder of the feeding mechanism is moved from the processing chamber through the feeding chamber to a load lock chamber and further can be removed from the semiconductor device manufacturing machine. Thus, the ring-like peripheral member is held and transferred by the holder for holding and transferring the semiconductor wafer, and therefore, the ring-like peripheral member can be exchanged without breaking the vacuum condition of the processing chamber. Therefore, the operating efficiency of the semiconductor device manufacturing machine can be remarkably elevated.

Semiconductor device manufacturing machine and method for manufacturing a semiconductor device by using THE same manufacturing machine

A semiconductor device manufacturing machine comprises a mechanism provided in a processing chamber, for lifting up a ring-like peripheral member, and a holder provided at a tip end of a feeding mechanism located in a feeding chamber, and capable of holding either or both a semiconductor wafer and the ring-like peripheral member, so that, in the processing chamber maintained in a vacuum condition, the ring-like peripheral member is lifted up by the lifting mechanism and transferred to the holder of the feeding mechanism, and the ring-like peripheral member held by the holder of the feeding mechanism is moved from the processing chamber through the feeding chamber to a load lock chamber and further can be removed from of the semiconductor device manufacturing machine. Thus, the ring-like peripheral member is held and transferred by the holder for holding and transferring the semiconductor wafer, and therefore, the ring-like peripheral member can be exchanged without breaking the vacuum condition of the processing chamber.

Semiconductor device manufacturing machine and method for manufacturing

The method for producing electrolyzed water includes the step of applying a voltage to electrodes disposed in an electrolytic cell containing therein pure water including electrolyte therein. A strength of an electric field generated by applying a voltage to the electrodes is controlled to be variable by means of various techniques. The method makes it possible to produce electrolyzed water with a smaller amount of energy than prior methods.

Method for producing electrolyzed water

A method and apparatus for separating heavy metal ions from a processing solution includes a filter. A cylindrical separating member divides the filter into two discrete compartments, an inner cylindrical portion and an outer annular portion concentrically arranged outside the inner cylindrical portion. The separating member is made of chemical and heat resistant material. The processing solution is made to flow through the inner portion in one direction and a gas is made to flow through the outer portion in the opposite direction. The flowing has negatively charges the separating member, which results in formation of an electrical double layer on the surface where the processing solution contacts the separating member. The heavy metal ions in the processing solution, which ions are positively charged, are attracted and adsorbed to the negatively charged separating member, thus removing the heavy metal ions from the processing solution.

Method for removing heavy metal ions dissolved in a solution

In a wet processing apparatus, an electrolytic cell, a first storing cell for storing anode active water of the electrolytic cell, a first processing cell for processing a target with the anode active water of the first storing cell, a second storing cell for storing cathode active water of the electrolytic cell, and a second processing cell for processing a target with the cathode active water of the second storing cell are provided. Also, a first reactivating feedback path is provided between the first processing cell and an anode region of the electrolytic cell, and a second reactivating feedback path is provided between the second processing cell and a cathode region of the electrolytic cell.

Growing community of inventors

Tokyo, Japan

Hirofumi Seo