Sony Semiconductor Solutions Corporation

Hirofumi Owaki

Hiroo Suzuki

Takuya Yamaguchi

Yutaro Yamashita

Tomonori Agawa

Kunihiko Togano

[Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components. [Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a synthetic resin material that has absorptive properties with respect to first laser light. The second member is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light. The third member is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member.

Sensor module

A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

A sensor module according to an embodiment of the present technology includes a sensor element, a first casing, a bracket, and a second casing. The first casing includes an opening end and accommodates therein the sensor element. The bracket fixes the first casing to an attachment target. The second casing includes a first surface that includes a first welding portion welded to the opening end, and a second surface that includes a second welding portion welded to the bracket, the second casing being fixed between the first casing and the bracket.

Sensor module and method for producing sensor module by laser welding

A camera module includes a housing, a barrel member, a sensor board, and a metallic shield case. The housing includes a first case that includes an opening, and a second case that is joined to the first case. The barrel member is arranged in the first case, and includes a barrel that is fitted into the opening in an optical-axis direction. The sensor board is arranged in the housing and includes an imaging device that faces the barrel member. The shield case is arranged between the barrel member and the second case.

Camera module

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

Camera module, spacer component, and method for producing camera module

An image processing apparatus includes a first signal processing unit for generating a first image of a first angle of view from an image captured by a camera attached to a vehicle body, and an image superimposing unit for superimposing an image representing a part of the vehicle body on the first image.

Image processing apparatus, camera system, and image processing method for superimposing an image representing a part of a vehicle body

The present technology relates to a connector device and a connector system capable of achieving reduction in manufacturing cost. Provided is a connector device including a first contact used in actual use, and a second contact used only in manufacturing, in which the first contact and the second contact have different core lengths in a case of being viewed from a connection target side. The present technology can be applied to a camera device electrically connected to a vehicle connector, for example.

Connector device and connector system

An image-capturing apparatus according to an embodiment of the present technology includes a first case, a second case, a connection mechanism, and an elastic member. The first case includes a first pressing surface. The second case includes a second pressing surface arranged to face the first pressing surface, and is connected to the first case. The connection mechanism is capable of connecting the first and second cases. The elastic member includes a first contact portion and a second contact portion in at least some of cross-sections of the elastic member, the first contact portion being brought into contact with the first pressing surface, the second contact portion being brought into contact with the second pressing surface, the elastic member including a plurality of the second contact portions, the elastic member hermetically sealing a space between the first and second pressing surfaces.

Image-capturing apparatus and housing component

To provide an electronic apparatus, a camera apparatus, and a shield chassis to be installed in a vehicle and used, whose ground is reinforced. A flexible printed circuit includes an FPC extension portion which is a ground pattern portion extended from a terminal portion for electrically connecting to on the side of the board. On the other hand, a clip portion whose cross-section has an approximately C-shape and whose upper surface includes an opening formed therein is formed at an upper end edge of one wall surface of a shield chassis. A tongue portion of the FPC extension portion, which is inserted through the opening, is sandwiched by the clip portion, such that the FPC extension portion is fixed to the shield chassis.

Growing community of inventors

Kanagawa, Japan

Hirofumi Owaki