Daikin Industries, Ltd.

Hirofumi Mukae

Hideki Kono

Masaji Komori

Hiroshi Ito

Hirokazu Komori

Ayane Nakaue

A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

Resin composition for circuit board, molded body for circuit board, layered body for circuit board, and circuit board

A resin composition and a molded article. The resin composition contains a fluororesin and boron nitride particles, the fluororesin being present in an amount of 35 to 70% by mass and the boron nitride particles being present in an amount of 30 to 65% by mass, each relative to the resin composition, the resin composition having a melt flow rate of 5.0 g/10 min or more.

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Osaka, Japan

Hirofumi Mukae