Other

Mitsubishi Denki Kabushiki Kaisha

Hirofumi Makimoto

Yoshihiro Tomita

Hironori Matsushima

A semiconductor wafer and a substrate are positioned facing each other, and electrode pads of individual semiconductor chips and connecting electrode pads of package bases are bonded simultaneously. The semiconductor wafer and the substrate are cut at the same time and divided into semiconductor chips. After expanding spaces between the divided semiconductor chips a predetermined width in an expanding process, a sealing resin is applied so that the large number of semiconductor chips and package bases are sealed with the resin at the same time. Then the semiconductor chips are cut and divided into separate pieces. Thus, semiconductor devices sealed with a resin are formed.

Method of making chip scale package

A thermosetting epoxy adhesive is applied at the end portion of one surface of the radiating plate onto which a protection ring is bonded, and a protection tape provided with projections is pasted with the thermosetting epoxy adhesive so that projections may project to the opposite side of the radiating plate , to constitute the radiating plate structure as one piece. And the radiating plate structures are stacked within the magazine of the radiating plate mounting machine, each radiating plate structure being picked up by the radiating plate mounting machine, its protection tape being peeled, the radiating plate being mounted at a predetermined position.

Growing community of inventors

Kumamoto, Japan

Hirofumi Makimoto