Seiko Epson Corporation

Hirofumi Kurosawa

Masaki Hoshina

Masaya Ishida

Masahiro Furusawa

Tetsuya Otsuki

Noboru Furuya

Takashi Hashimoto

Hiroshi Miki

Kimio Hirono

Yoshinori Hagio

This electronic device package includes a substrate upon which an electronic device is mounted, a plurality of device electrodes which are formed upon an electronic device, a plurality of substrate electrodes which are formed upon the substrate, and a plurality of connection lines, formed by a liquid drop ejection method, each of which electrically connects together one of the plurality of device electrodes and one of the plurality of substrate electrodes. The plurality of substrate electrodes are arranged in a staggered configuration.

Electronic device package and electronic equipment

An electrophoresis display includes an element substrate; a counter substrate; an electrophoresis layer sandwiched between the element substrate and the counter substrate; and a driver circuit disposed in an area of the element substrate that is outside a display area. In this electrophoresis display, the counter substrate overlaps the display area and at least part of an area of the element substrate where the driver circuit is disposed.

Electrophoresis display and electronic apparatus including an electrophoresis display

A contactless data communication system includes a reader-writer device, a contactless identification tag including a plurality of contactless identification tags, and baggage including multiple pieces of baggage. The reader-writer device includes a data reception part, a data transmission part, a control part, an operation part, and a display part. The contactless identification tag includes a data communication part, a data control part, a voltage monitoring part, a detachment detection part, a display processing part, and an electrophoresis display device. The voltage monitoring part and the detachment detection part detect a voltage change caused when the contactless identification tag is detached from the baggage, so as to detect that the contactless identification tag is detached.

Contactless data communication system, contactless identification tag and contactless identification tag control program

An electronic element (a semiconductor chip) is joining on a wiring board with the active surface thereof facing up (die-bonding step). A slope linked from the surface of the wiring board to the active surface of the electronic element is formed at the periphery of the electronic element (slope forming step). Metallic wiring for connecting electrode terminals on the active surface to wiring patterns on the wiring board is formed on the surface of the slope by a droplet ejection method (metallic wiring forming step). In the invention, prior to forming the metallic wiring, an organic insulating membrane formed of epoxy resin or urethane resin is formed on the active surface of the electronic element, on which the corresponding metallic wiring is formed (insulative ink processing step), thereby improving adhesivity.

Method for mounting an electronic element on a wiring board

A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns), polyamide(an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post)for conducting between the wiring patternand the wiring patternwherein the polyimideis disposed around the interlayer conducting postusing a liquid drop discharge system.

Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus

An adhesive tape constructed of a base materialand an adhesive layeris used as a substrate. Dropletsformed of a liquid containing electrically conductive ultra-fine particles dispersed therein are disposed in a specified wiring pattern on the adhesive layer. The adhesive tapeis put into a hot-air ovento dry the disperse medium from the droplets. Accordingly, a wiring layermade of silver particles contained in the dropletsis formed on the adhesive layerof the adhesive tape

Method for forming pattern and method for forming multilayer wiring structure by droplet discharge system

A receiving layer is formed from a thermosetting resin precursor. An interconnecting layer is formed on the receiving layer from a dispersion liquid containing conductive particles. Heat is applied to the receiving layer and the interconnecting layer to cure the thermosetting resin precursor and to bond the conductive particles together.

Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument

Contactless data communication system, countactless identification tag and contactless identification tag control program

A glass substrate is affixed through an UV-hardening resin to the signal face of an optical stamper and is examined using an optical head having optical constants equivalent to those of a disk examination machine, thus making it possible to obtain characteristic playback examination results equivalent to those obtained from disks manufactured using the optical stamper, wherefore optical stamper quality can be easily assessed.

Growing community of inventors

Tatsuno-machi, Japan

Hirofumi Kurosawa