Sumitomo Bakelite Company Limited

Kayaba Industry Company, Ltd.

Hirofumi Kuroda

Keisuke Mishima

Masashi Endo

Hiroki Nikaido

Ken Ukawa

A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175&#xb0; C. and a measurement frequency of about 100 Hz, minimum ion viscosity appears at about 5 seconds or later and within about 40 seconds from a measurement starting point. The minimum ion viscosity is at least about 4.0 and at most about 7.0. A maximum slope of the ion viscosity appears at about 10 seconds or later and within about 60 seconds from the measurement starting point. The maximum slope is at least about 2.0 and at most about 6.0.

Semiconductor-encapsulating resin composition and semiconductor device

A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and 'n' represents a mean value that is a positive number of from 0 to 5; in the formula (1).

Resin composition for semiconductor encapsulation and semiconductor device

A press-molding device () press molds a bottom portion of a work piece () having a closed-end shape between an, inner die () inserted into the work piece () and an outer die () disposed on an outside of the work piece (). A chuck position switching mechanism () grips the work piece () so that the work piece () can move in an axial direction. An inner die moving mechanism () inserts the inner die () into the inside end of the work piece (). A stopper mechanism () supports the inner die () in a processing position by restricting movement of the inner die (). An outer die moving mechanism () press-molds the bottom portion of the work piece () between the outer die () and the inner die (), thereby press-molding the workpiece () smoothly without damaging an inner peripheral surface of the workpiece ().

Press-molding method and press-molding device

A cooling device () for cooling a work piece () that has reached a high temperature due to the implementation of a closing operation in which a bottom portion () is formed by closing an end portion of the tubular work piece () comprises a tilting mechanism () which tilts the work piece () such that the bottom portion () faces downwards and a cooling water tank () storing cooling water. The bottom portion () of the work piece () tilted by the tilting mechanism () is submerged in cooling water stored in the cooling water tank ().

Cooling method and cooling device

The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation comprising (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and 'n' represents a mean value that is a positive number of from 0 to 5; in the formula (1).

A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C-Caryl group, R1 is a C-Chydrocarbon group, R2 is a C-Chydrocarbon group, W1 is oxygen or sulfur, RO is a C-Chydrocarbon group, a=0-10, g=0-3, 0&#x3c;m&#x3c;1, 0&#x3c;n&#x3c;1, m+n=1 and m:n=1:10 to 1:1, and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85&#xb0; C. and 85% R.H. for 168 hours: 

Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator

This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.

Epoxy resin composition for encapsulating semiconductor and semiconductor device

An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent soldering heat resistance and a higher productivity, as well as a semiconductor device manufactured by encapsulating therewith. This invention relates to a epoxy resin composition for encapsulating a semiconductor comprising, as essential components, (A) an epoxy resin having a particular structure and (B) a phenolic resin comprising a phenolic resin component having a particular structure as a main component, which contains a component having up to three aromatic rings in one molecule in 0.8% or less in an area ratio as determined by GPC analysis, as well as a semiconductor device manufactured by encapsulating a semiconductor chip with the composition.

Biphenylaralkyl epoxy and phenolic resins

An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this invention provides a resin composition for encapsulating a semiconductor chip comprises an epoxy resin (A) containing the specific structure; a phenolic resin (B) containing the specific structure; an inorganic filler (C); a curing accelerator (D); a silane coupling agent (E); and Compound (F) containing an aromatic ring in which at least two adjacent carbon atoms of the ring member carbon atoms are coupled to a hydroxyl group, respectively.

Resin composition for encapsulating semiconductor chip and semiconductor device therewith

The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 &#x3bc;m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.

Growing community of inventors

Tokyo, Japan

Hirofumi Kuroda