Ricoh Company, Ltd.

Hirofumi Kobayashi

Takeshi Sano

Hideaki Ohkura

Yoshihiro Yoshida

Kunio Ikeda

A retaining structure of a flexible wiring member includes a flexible wiring member and a retaining member. The flexible wiring member includes a front side wiring electrode formed on a front side of the flexible wiring member and a rear side electrode formed on a rear side thereof, and the flexible wiring member is bonded to the retaining member via the rear side electrode. Such structure may be employed in a liquid discharge head in which wiring and a pressure generator are disposed in an actuator substrate including an electrode. The electrode of the actuator and that of the flexible wiring member are connected, and the flexible wiring member is retained to the actuator or a member joined to the actuator via the retaining structure of the wiring member.

Retaining structure of wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus

An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.

Method of forming conductive pattern

A wiring pattern-forming apparatus, includes a transfer platefor transferring a wiring materialarranged to form a wiring pattern onto a substrate, a wiring material feederfor feeding the wiring materialonto the transfer plate, and an energy feederto feed energy to the wiring materialfed to the transfer plateby the wiring material feeder. By utilizing the energy fed from the energy feeder, the viscosity of the wiring materialwhen the materialis fed from the material feederto the transfer plateis made different from that of the wiring materialwhen the materialis transferred from the transfer plateto the substrate

Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof

A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.

Growing community of inventors

Kanagawa, Japan

Hirofumi Kobayashi