Sony Corporation

Sony Semiconductor Solutions Corporation

Hirofumi Kawamura

Yasuhiro Okada

Yoshiyuki Akiyama

Hidekazu Kikuchi

Motohiko Nagano

Motomasa Futagami

Takayuki Mogi

Yoji Kawamoto

Norihito Mihota

Masayoshi Abe

Osamu Kozakai

Hiroaki Fujita

Takashi Miyamoto

Hisashi Masuda

Youji Kawamoto

Shigenori Uchida

Ching Biing Yeo

Ken Matsui

Naoto Nakamura

Yu Gang Ma

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Signal transmission system, connector apparatus, electronic device, and signal transmission method

A communication apparatus according to the disclosure includes one or a plurality of sensors, a communicator that performs proximity wireless communication, and a connection section that couples one of a plurality of antennae to the communicator, on a basis of a detection result of the one or the plurality of sensors.

Communication apparatus, power receiving apparatus, and antenna switching method

A waveguide, printed circuit board and a method of fabricating a waveguide that includes: providing a ceramic powder and polymer binder slurry, and forming the waveguide from the slurry. The waveguide and a printed circuit that includes the waveguide are also described.

Waveguide and method for making a waveguide

Disclosed herein is a semiconductor device including: a semiconductor circuit element configured to process an electrical signal having a predetermined frequency; and a transmission line configured to be connected to the semiconductor circuit element via a wire and transmit the electrical signal. An impedance matching pattern having a symmetric shape with respect to a direction of the transmission line is provided in the transmission line.

Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system

A millimeter-wave dielectric transmission device. The millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission method

A millimeter wave transmission device, the millimeter wave transmission device with (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

A radio transmission system includes: a first electronic device; and a second electronic device having a mounting structure mounted with the first electronic device, wherein a millimeter wave signal transmission line capable of transmitting information in a millimeter wave band is formed between the first electronic device and the second electronic device when the first electronic device is mounted in the mounting structure of the second electronic device, and between the first electronic device and the second electronic device, a transmission object signal is converted into a millimeter wave signal and then the millimeter wave signal is transmitted via the millimeter wave signal transmission line.

Radio transmission system and electronic device

A signal transmission device includes: a communication device that transmits first information and second information, wherein at the time of transmitting the first information, the communication device controls a strength of a transmission signal thereof on the basis of the second information.

Signal transmission device, communication device, electronic apparatus, and signal transmission method

Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission

Signal distribution, signal switching, and signal collection are performed with a simple configuration. An electronic device comprises a transmission unit () for transmitting, as a wireless signal, a signal to be transmitted and a reception unit () for receiving the wireless signal transmitted from the transmission unit. In the electronic device, a plurality of pairs of wireless signal transmission points in the transmission unit and wireless signal reception points in the reception unit can be formed. Using the pairs of transmission points and reception points make it possible to execute at least either one of signal distribution in which the same signal to be transmitted from a transmission point is transmitted to the multiple reception points and signal switching in which a signal to be transmitted from a transmission point is selectively transmitted to any of the multiple reception points. The signal to be transmitted is transmitted as a wireless signal. In this case, the signal distribution, signal switching, and signal collection are performed in a wireless signal portion. Since a portion where a signal transmission is performed through electric wiring does not interpose the portion where the signal distribution, signal switching, and signal collection are performed, the signal distribution, signal switching, and signal collection can be performed with a simple configuration.

Electronic device, signal transmission device, and signal transmission method

Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

A signal transmission device includes: a transmitting device that transmits a transmission subject signal through a first waveguide as a wireless signal; and a receiving device that receives the wireless signal of the transmission subject signal transmitted from the transmitting device through a second waveguide, wherein the wireless signal is transmitted between the transmitting device and the receiving device in a state where the first waveguide faces the second waveguide.

Growing community of inventors

Chiba, Japan

Hirofumi Kawamura