Hitachi Via Mechanics Ltd.

Hirofumi Kado

Yasushi Ito

Katsuhiro Nagasawa

Nobuhiko Suzuki

Hiroyuki Kamata

Shintaro Takahashi

A printed circuit board machining apparatus includes a spindle that holds a tool for machining a printed circuit board and a pressure unit for pressing the printed circuit board to a table in machining the printed circuit board. The pressure unit includes a pressure foot movable up an down along the spindle, a rotating member having a plurality of pressure pieces through which a through hole for passing the tool is formed and provided so as to select one among the plurality of pressure pieces, a motor for moving the rotating member, cylinders and electromagnetic valves for moving the pressure foot up and down and a control section for controlling the cylinders and electromagnetic valves. The control section rotates the motor so as to select the pressure piece and controls the cylinders and the electromagnetic valves to change force for pressing the printed circuit board.

Printed circuit board machining apparatus

There is provided a printed board machining apparatus that is capable of improving machining efficiency without hampering machining accuracy. The printed board machining apparatus includes a pressure foot which is provided with a port whose one end is opened at a lower surface of the pressure foot facing a stiffening plate, and whose other end is connected to a compressed gas source to blow out gas from the port at a pressure which does not interfere with the pressure foot pressurizing the stiffening plate and printed boards in machining the printed boards. It is noted that the gas is blown out during a period of time at least when the pressure foot and the stiffening plate are moving relatively in the horizontal direction.

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Ebina, Japan

Hirofumi Kado