Nippon Steel Corporation

Nippon Steel Sumitomo Metal Corporation

Hirofumi Imai

Hideyuki Hamamura

Koji Hirano

Tatsuhiko Sakai

Fumiaki Takahashi

Hisashi Mogi

Shunsuke Okumura

Naoya Hamada

Atsushi Sugihashi

Motoi Kido

Satoshi Yamaguchi

Satoshi Arai

Yasushi Hasegawa

Kenichi Murakami

Masato Mizokami

Shinya Hayashi

Takahito Mizumura

In a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet by setting a laser beam to be focused on the grain-oriented electromagnetic steel sheet and scanned in a scanning direction, the laser beam focused on the grain-oriented electromagnetic steel sheet is linearly polarized light, and an angle between a linear polarization direction and the scanning direction is higher than 45&#xb0; and equal to or lower than 90&#xb0;.

Laser processing apparatus

Provided is a grain-oriented electrical steel sheet including a steel sheet having a steel sheet surface in which a groove, which extends in a direction intersecting a rolling direction and of which a groove depth direction matches a sheet thickness direction, is formed. In a case where the steel sheet surface is seen from the sheet thickness direction, the steel sheet surface is provided with a groove group that is constituted by a plurality of the grooves arranged in a sheet width direction, the grooves, which constitute the groove group, are arranged in such a manner that adjacent grooves overlap each other on a projection plane perpendicular to the rolling direction, and a plurality of the groove groups are arranged with an interval in the rolling direction.

Grain-oriented electrical steel sheet

In a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet by setting a laser beam to be focused on the grain-oriented electromagnetic steel sheet and scanned in a scanning direction, the laser beam focused on the grain-oriented electromagnetic steel sheet is linearly polarized light, and the angle between the linear polarization direction and the scanning direction is equal to or higher than 0&#xb0; and lower than 45&#xb0;.

A grain-oriented electrical steel sheet comprising a steel sheet having a surface on which grooves, in which an extending direction crosses a rolling direction and a depth direction is parallel to a sheet thickness direction, are formed, and wherein a molten solidified substance ranging in parallel to the groove exists on both sides of the groove on the surface of the steel sheet, and a height becoming a maximum frequency in a height distribution of height data in which the surface of the steel sheet in a specific area including the groove is measured at regular intervals is set as a virtual plane, and a value of V2/V1 is more than 0.10 and less than 0.80, wherein V1 is a space volume of recess parts recessed from the virtual plane and V2 is a volume of projection parts projected from the virtual plane.

Provided is a grain-oriented electrical steel sheet including a steel sheet having a steel sheet surface in which a groove, which extends in a direction intersecting a rolling direction and of which a groove depth direction matches a sheet thickness direction, is formed. When an average value of a groove depth in a sheet thickness direction at a central portion of the groove in a longitudinal groove direction is set as an average groove depth D, a straight line, which connects a first point at which a groove depth in the sheet thickness direction becomes 0.05&#xd7;D and a second point at which the groove depth becomes 0.50&#xd7;D, at an inclined portion of the groove is set as a groove end straight line, an angle made by the steel sheet surface and the groove end straight line is set as a first angle &#x3b8;, and an average value of a groove-width-direction length, which is a length of a line segment connecting two points at which a groove depth in the sheet thickness direction in a contour of the groove on the groove-width-direction cross-section becomes 0.05&#xd7;D, is set as an average groove width W, an aspect ratio A obtained by dividing the average groove depth D by the average groove width W, and the first angle &#x3b8; satisfy the following Expression (1).&#x3b8;&#x3c;&#x2212;21&#xd7;+77&#x2003;&#x2003;(1)

Provided is a grain-oriented electrical steel sheet including a steel sheet having a steel sheet surface in which a groove, which extends in a direction intersecting a rolling direction and of which a groove depth direction matches a sheet thickness direction, is formed. In a case where the groove is seen on a longitudinal groove cross-section including a groove extension direction and the sheet thickness direction, an arithmetic average height Ra of a roughness curve, which constitutes a contour of a groove bottom region of the groove, is 1 &#x3bc;m to 3 &#x3bc;m, and an average length RSm of a roughness curve element, which constitutes the contour of the groove bottom region, is 10 &#x3bc;m to 150 &#x3bc;m.

A grain-oriented magnetic steel sheet includes grooves each of which extends in a direction intersecting a transportation direction, the grooves being formed at predetermined pitches PL in the transportation direction by laser beam irradiation, in which a relationship between a standard deviation value D and the pitch PL satisfies the following expression (1), the standard deviation value D being a standard deviation of distances between a linear approximation line, which is obtained from a center line of each of the grooves in a groove width direction by a least-squares method, and respective positions on the center line, and an average angle formed between tangent lines of the respective positions on the center line and a direction perpendicular to the transportation direction is more than 0&#xb0; to 30&#xb0;.[Expression 1]0.02&#x2264;()&#x2003;&#x2003;(1)

Grain-oriented magnetic steel sheet and method of producing the same

A laser processing apparatus includes a laser irradiation unit has a structure providing an intensity distribution of the laser beam focused on the grain-oriented electrical steel sheet on a cross-section in a direction perpendicular to the scanning direction on the grain-oriented electrical steel sheet so as to satisfy Ib/Ia&#x2266;2, where Raand Raare distances between the centroid of the intensity distribution and positions at which the intensity integration value from the centroid of the intensity distribution is 43% of the total intensity integration value, beam intensities Iaand Iaare intensities of the laser beam corresponding to Raand Ra, respectively, Ia is the average value of Iaand Iaand Ib is the beam intensity at the centroid of the intensity distribution.

Laser processing apparatus and laser irradiation method

[Object] To provide a laser processing apparatus and a laser processing method which are capable of reducing roughness of a cut surface in laser cutting using laser beams transmitted through optical fibers. [Solution] A laser processing apparatus according to the present invention includes at least one laser oscillator configured to emit laser beams, a plurality of optical fibers configured to transmit the emitted laser beams, and at least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate a surface of a workpiece with the focused laser beams. At output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes. Laser beams transmitted through the plurality of optical fibers placed on at least an outermost ring of the ring shapes each have a linear polarization, and polarization directions of the linearly polarized laser beams emitted from the output ends of the plurality of optical fibers are arranged radially around a center of the outermost ring.

Laser processing apparatus and laser processing method

A laser apparatus of the present invention has a first laser oscillator that emits a first laser beam; a passive fiber that is a double-clad fiber that transmits the first laser beam through a core; and a second laser oscillator that emits a second laser beam that is coupled into inner cladding of the passive fiber. Additionally, a laser materials processing apparatus of the present invention is provided with the laser apparatus; and an irradiation optical system having a collimating lens and a condenser lens.

Laser apparatus and laser materials processing apparatus provided with same

The present invention provides a method of producing a common rail having a common rail body and a holder which include chemical components of 0.01-0.3 mass % of C, 0.01-0.5 mass % of Si, 0.01-3.0 mass % of Mn, 0.0003-0.01 mass % of B, 0.001-0.01 mass % of N, over 0.01-0.5 mass % of Al, 0.01-0.05 mass % of Ti, P limited to 0.03 mass % or less, S limited to 0.01 mass % or less, O limited to 0.01 mass % or less, a total content of As, Sn, Sb, Pb, and Zn limited to 0.015 mass % or less, the balance including Fe and inevitable impurities, in which the TLB value is 0.001% or more, the method including: inserting an insert metal; performing liquid phase diffusion bonding; performing laser-peening; and removing a surface layer.

Method of producing common rail and common rail

A semiconductor laser device including a laser element stack array emitting a two-dimensional array shaped group of laser beams consisting of rows of laser beams arranged linearly in parallel in a broken line configuration and optical elements arranged in front of the array, receiving rows of laser beams bent and collimated in a direction substantially perpendicular to the orientation of the broken line configuration. Laser beams are emitted from emitters or groups of emitters and are rotated by right angles so as to convert the laser beams to a plurality of rows aligned in parallel in an approximate ladder rung configuration and the distance between center axes of the rows of laser beams is shortened to condense the laser beams by converting them to a group of laser beams emitted from a common object and thereby making all laser beams converge to a single image.

Semiconductor laser device and solid-state laser device using same

A semiconductor laser apparatus according to an exemplary embodiment of the present invention is provided. For example, the apparatus may include a single or a plurality of stacked-array laser diodes, first beam compressors, and a separating optical device separating the group of laser beams into subgroups of laser beams in a first direction, and deflecting the subgroups of laser beams so that the subgroups of laser beams approach in the first direction and recede from one another in a second direction. In addition, a collimating optical device may be provided which is adapted to deflect the subgroups of laser beams in the first and second directions by the same angles. Further, a beam converter may be included which divides each subgroup of laser beams and turning the axis thereof, and second beam compressors and a group of cylindrical lenses can be provided that can make the angle of divergence in the first direction close to the angle of divergence in the second direction.

Semiconductor laser apparatus capable of routing laser beams emitted from stacked-array laser diode to optical fiber with little loss

Light beams output from active layer stripes of a semiconductor laser array are individually collimated in a GRIN lens array and are converged, in a aspheric lens, into a beam spot, to thereby end-pump a solid state laser with high efficiency.

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Kisarazu, Japan

Hirofumi Imai