Tanaka Kikinzoku Kogyo K.k.

Chubu Electric Power Company, Inc.

Hirofumi Hoshino

Shigeo Nagaya

Kunihiro Shima

Naoji Kashima

The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The present invention provides a clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a silver layer bonded to at least one face of the metallic layer, wherein the silver layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;9 degree. The textured metal substrate can be manufactured by subjecting the silver sheet containing 30 to 200 ppm oxygen by concentration to the orienting treatment of hot-working and heat-treating, and bonding the metal sheet with the oriented silver sheet by using a surface activated bonding process.

Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same

The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. A clad textured metal substrate for forming the epitaxial thin film thereon according to the present invention comprises a metallic layer and a nickel layer which is bonded to at least one face of the metallic layer, wherein the nickel layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;7 degrees and has a nickel purity of 99.9% or more. The oriented metal substrate is manufactured by cold-working the nickel sheet having a purity of 99.9% or more, heat-treating it for orientation, and bonding the metal sheet with the oriented nickel sheet by using a surface activated bonding process.

A method for manufacturing a oriented substrate for forming an epitaxial thin film thereon, having a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The clad textured metal substrate includes a metallic layer and a copper layer bonded to at least one face of the above described metallic layer, wherein the above described copper layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;6 degree. The substrate has an intermediate layer on the surface of the copper layer, to form the epitaxial thin film thereon.

A clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the metallic layer, wherein the copper layer has a {100}&#x3c;001&#x3e; cube texture in which a deviating angle &#x394;&#x3c6; of crystal axes satisfies &#x394;&#x3c6;&#x2266;6 degree. The clad textured metal substrate has an intermediate layer on the surface of the copper layer to form the epitaxial thin film thereon. The intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.

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Gunma, Japan

Hirofumi Hoshino