Jsr Corporation

Samsung Electronics Co., Ltd.

Ibiden Company Limited

Hirofumi Goto

Atsushi Ito

Hirofumi Sasaki

Nobuyuki Ito

Takashi Kariya

Toshiki Furutani

Shin-ichiro Iwanaga

Takayoshi Tanabe

Yuichi Hashiguchi

Soo-Kyung Kim

Myung-sun Kim

Takashi Nishioka

Hyojin Yun

Kouji Nishikawa

Hidetoshi Miyamoto

Shigehito Asano

Changeun Yoo

Takako Yamada

Ryuichi Okuda

A compound synthesis method includes bonding a first compound to a substrate to form a first film. A second film is formed on the first film using an acid-transfer composition including (A) a polymer that includes a structural unit shown by a following formula (1) and a structural unit shown by a following formula (2), (B) a photoacid generator shown by a following formula (3), and (C) a sensitizer shown by a following formula (4). The second film is exposed to remove the protecting group from the first compound under an exposed area of the second film. An acid generated in the exposed area of the second film is transferred to the first film. The second film after being exposed is removed. A second compound is bonded to the first compound from which the protecting group has been removed. 

Compound synthesis method, microarray, acid-transfer composition, and biochip composition

A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.

Photosensitive insulating resin composition, hardening product thereof, and circuit board equipped therewith

A photosensitive insulating resin composition includes a block copolymer, a crosslinking agent, a photosensitive compound, and a solvent. The block copolymer includes a first structural unit shown by a following formula (1) and a second structural unit shown by a following formula (2), wherein Rrepresents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and Rrepresents an alkyl group having 1 to 4 carbon atoms.

Photosensitive insulating resin composition, cured product thereof and ABA block copolymer

The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.]

Photosensitive insulating resin composition, cured product thereof and electronic component comprising the same

A multilayer printed wiring board is equipped with a core board, a build-up layerformed on the core boardso as to have a conductor patternon the upper surface thereof, a low-elasticity layerformed on the build-up layer, landsthat are provided on the upper surface of the low-elasticity layerand connected to an IC chipvia solder bumps, and conductor poststhat penetrate through the low-elasticity layerand electrically connect the landsto the conductor pattern. The low-elasticity layeris formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.

Multilayer printed wiring board

A high dielectric constant film is prepared by electrodepositing a film from an aqueous dispersion comprising inorganic particles comprised of a compound selected from the group consisting of barium titanate, lead titanate, bismuth titanate, magnesium titanate and neodymium titanate, having a mean particle size of no greater than 1 &#x3bc;m and a dielectric constant of at least 30, and organic particles comprised of either or both of a polymerizable compound and a polymer, wherein the organic particles have a charge on the particle surfaces and fulfill at least one of the following conditions (i) and (ii)

Aqueous dispersion for electrodeposition, high dielectric constant film and electronic parts

Disclosed is a positive photosensitive insulating resin composition including: The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.

Positive photosensitive insulating resin composition, cured product thereof, and electronic component

It is an object of the invention to provide an aqueous dispersion for electrodeposition which has excellent shelf life and can form thin, high dielectric constant films, as well as a high dielectric constant film formed from the aqueous dispersion and electronic parts provided with the high dielectric constant film. The aqueous dispersion for electrodeposition according to the invention is characterized in that organic particles with a mean particle size of no greater than 1 &mgr;m and a dielectric constant of at least 30 (titanium dioxide particles and the like) and organic particles composed of either or both a polymerizable compound and a polymer (polyimide-based resin and the like) are dispersed in an aqueous medium, allowing storage for a period of 7 days or longer at 20&deg; C. The high dielectric constant film of the invention obtained by electrodeposition of the aqueous dispersion for electrodeposition may have a dielectric constant of 6 or greater and a volume resistivity of 10 &OHgr;&middot;cm or greater. It may be used for electronic parts such as printed circuit boards, semiconductor packages, condensers and high-frequency antennas.

A polyimide-based composite according to the invention is formed using a precursor comprising (A) a polyimide component and (B) another polymer component, wherein the polyimide forms a continuous phase and the other polymer forms a discontinuous phase, and the elastic modulus is less than 10 GPa. This structure provides both the properties of insulation, etc. contributed by the polyimide and the properties of low elastic modulus and satisfactory adhesion, moldability, etc. contributed by the other polymer. The polyimlde-based aqueous dispersion of the invention has dispersed therein particles with a mean particle size of 0.03-5 &mgr;m comprising the precursor of the polyimide-based composite, the dispersed particles including in the same particles the (A) polyimide component and (B) other polymer component comprising a hydrophilic polymer. This gives satisfactory storage stability to the aqueous dispersion.

Growing community of inventors

Tokyo, Japan

Hirofumi Goto