Nitto-Denko Corporation

Hirofumi Ebe

Yasuto Ishimaru

Shinichi Inoue

Yoshihiro Furukawa

Takashi Habu

Takashi Yamamoto

Katsuya Kume

Miho Yamaguchi

Izumi Ozeki

Tomohiro Omure

Shotaro Masuda

Kazuo Ouchi

Hiroyuki Hanazono

Kenichi Fujikawa

Eiichi Imoto

Shoichiro Saito

Makoto Fujihara

Toshiaki Okuno

Toshinobu Hoshino

Akihito Matsutomi

Masakazu Morimoto

Hiroshi Matsuo

Yuki Kato

Tomoya Matsuda

Katsuyuki Nakabayashi

Hirofumi Ono

Provided is a method for producing a sintered body that forms a rare-earth permanent magnet, has a single sintered structure and an arbitrary shape, and has easy magnetization axis orientations of different directions applied to the magnet material particles in a plurality of arbitrary regions. This method forms a three-dimensional first molded article from a composite material formed by mixing a resin material and magnet material particles containing a rare-earth substance. The first molded article is then subjected to a deforming force and a second molded article is formed in which the orientation direction of the easy magnetization axis of the magnet material particles in at least the one section of the horizontal cross-section is changed to a direction which differs from the orientation direction of the first molded article. The second molded article is heated to a sintering temperature and kept at the temperature for a period of time.

Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientation

Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size Dand a particle size Dmeasured with a laser diffraction particle size distribution analyzer satisfying formula below: D/D&#x3e;0.30.

Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device

A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.

Method for producing soft magnetic film laminate circuit board

A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.

Joining sheet, electronic component, and producing method thereof

A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1). 

Paste composition and printed circuit board

A conductor layer is formed on one surface of a base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and drawn-out conductor portions extending in long-sized shapes from the collector portions, respectively. Cover layers are formed on the base insulating layer to cover respective given portions of the conductor layer. A paste composition containing a compound represented by the formula (1) is used as a material for the cover layer. 

A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.

Printed circuit board and method of manufacturing the same

Each wiring pattern is composed of a conductor layer and a tin plating layer, and includes a tip portion, a connection portion and a signal transmission portion. The width of the tip portion is equal to the width of the signal transmission portion, and the width of the connection portion is smaller than the widths of the tip portion and the signal transmission portion. The connection portions of wiring patterns and bumps of an electronic component are connected to one another, respectively, by heat-sealing when the electronic component is mounted. Respective distances A, Aare set to not less than 0.5 &#x3bc;m. Respective distances B, Bare set to not less than 20 &#x3bc;m. The thickness of the tin plating layer is set to not less than 0.07 &#x3bc;m and not more than 0.25 &#x3bc;m.

Connection structure between printed circuit board and electronic component

A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween.

A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.

A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A&#xb1;&#x3b4;) [%] with respect to the whole area of the metal layer. Here, &#x3b4; is an acceptable error range, and the acceptable error range &#x3b4; is not more than (A&#xd7;0.3).

A COF board includes an insulating layer, and a terminal portion formed on the insulating layer. The terminal portion includes a first lead extending in a longitudinal direction, and a second lead extending in the longitudinal direction, and having a smaller length in the longitudinal direction than a length of the first lead in the longitudinal direction. The first leads are arranged in spaced-apart relation in a direction perpendicular to the longitudinal direction. The second leads are arranged in the direction perpendicular to the longitudinal direction to be interposed between the mutually adjacent first leads such that, when the mutually adjacent first leads are projected in an adjacent direction thereof, overlap portions where the second leads overlap with the first leads and non-overlap portions where the second leads do not overlap with the first leads are formed. Dummy leads are provided at the non-overlap portions.

Growing community of inventors

Ibaraki, Japan

Hirofumi Ebe