Tdk Corporation

Hirobumi Tanaka

Keisuke Okai

Yohei Noda

Makoto Endo

Toshio Sakurai

Daisuke Iwanaga

Hisashi Nakata

Tomoya Shibasaki

Hiroshi Shindo

Katsuhiko Igarashi

Yui Sugiura

Tomomichi Gunji

Yusuke Sato

Taisuke Masuko

Osamu Kido

Daisuke Yoshida

Toshihiko Kaneko

Yasuo Watanabe

Daisuke Ueda

Masakazu Hosono

Shogo Murosawa

Yasushi Matsuyama

Saori Takeda

Satoko Ueda

Minoru Ogasawara

Tatsuya Kikuchi

Kenta Ono

Ryutaro Yamazaki

Tomoya Sihbasaki

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

Multi-layer ceramic electronic device

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. An upper-surface cover layer covering the upper surface of the element body located between the upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.

Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic electronic component includes an element body and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The terminal electrode is formed on an outer surface of the element body to be contacted and connected with the internal electrode layers. The terminal electrode includes an end-side electrode part and an upper-side electrode part. The end-side electrode part covers a leading end of the element body where the internal electrode layers are led. The upper-side electrode part is formed on a part of an upper surface of the element body and continues to the end-side electrode part. The terminal electrode is not substantially formed on a lower surface of the element body located on the other side of the upper surface along the lamination direction.

Multilayer ceramic electronic component

The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on a pair of side surfaces of the element body, facing each other. The insulating layers contain a glass composition and a ceramic composition.

Multilayer electronic component

The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on at least one side surface of the element body. The insulating layers contain a glass composition and a ceramic composition. The internal electrode layers contain a metal M and the ceramic composition contains an oxide of the metal M.

A multilayer electronic component includes an element body having internal electrode layers and dielectric layers. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces oppositely facing in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. End portions in the first axis direction of the internal electrode layers are recessed from end portions in the first axis direction of the dielectric layers to an inner side along the first axis direction. The retraction distances are varied at a predetermined range in each layer of the internal electrode layers.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces oppositely facing in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An end portion in the first axis direction of the internal electrode layer is recessed from an end portion in the first axis direction of the dielectric layer to the inner side along the first axis direction. A main component of the internal electrode layer is Ni. A reaction portion is between the end portion in the first axis direction of the internal electrode layer and the insulating layer.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These layers are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. A pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer. A pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer. The insulating layer has a mountain portion formed on a peripheral edge of the side surface and a plane portion of a central portion of the side surface.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An elastic modulus of the insulating layer is 12 GPa to 140 GPa.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer includes a glass component. A formula (1) of 0.25&#x3c;&#x3b1;/&#x3b2;&#x3c;1 is satisfied, where &#x3b1; denotes a thermal expansion coefficient of the insulating layer, and &#x3b2; denotes a thermal expansion coefficient of one of the internal electrode layer and the dielectric layer that is larger than a thermal expansion coefficient of the other layer.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer integrally has an insulating layer extension portion covering part of the end surfaces facing each other in the second axis direction. W/Wis 1/30 to less than &#x215c;, where Wdenotes a width along the first axis, and Wdenotes a width along the first axis of the insulating layer extension portion. The external electrode covers at least part of the insulating layer extension portion.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. A main component of the insulating layer is constituted by glass containing Si at 25 wt % or more. The external electrode includes glass containing at least Si. The external electrode covers an end portion in the second axial direction of the insulating layer. A diffusing layer is partially present at least at a bonding portion of the insulating layer with the external electrode in the side surface.

A compact laminated ceramic electronic component having superior moisture resistance and electrical properties is provided. A laminated ceramic electronic componentincludes an inner layer portion that contains a plurality of dielectric layersand internal electrode layerscomprising Ni as a main component that are laminated alternately, and a pair of dielectric outer layer portionswhich sandwich the inner layer portions. And Ni particles are segregated in the dielectric outer layer portions And the amount of Ni particles existing in the dielectric layersis smaller than that in the dielectric outer layer portions

Growing community of inventors

Tokyo, Japan

Hirobumi Tanaka