Toshiba Ceramics Co., Ltd.

Shibaura Mechatronics Corporation

Hiroaki Yuda

Yoshinori Hayashi

Koji Izunome

Hiromichi Isogai

Hiroyuki Naraidate

Atsushi Tanabe

A wafer inspection apparatus has a supporting means () for rotatably supporting a wafer (W) formed of a disk, a circumferential edge imaging means () for imaging a circumferential edge (S) of the wafer (W) that is supported by the supporting means for rotation, a notch imaging means () for imaging a notch (N), a notch illumination part () for illuminating the notch (N), and a control means () for processing image data imaged by the circumferential edge imaging means () and the notch imaging means (). The circumferential edge imaging means () has a plurality of imaging cameras () for imaging a plurality of different parts in a thickness direction of the circumferential edge of the wafer (W). The different parts of the circumferential edge (S) of the wafer (W) include an apex at right angles to a surface of the wafer (W) and a front side bevel and a back side bevel inclined relative to the apex. The notch imaging means () for the wafer (W) having the notch (N) has a plurality of imaging cameras () for imaging different parts in the thickness direction of the notch (N).

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Iwate, Japan

Hiroaki Yuda