Shinkawa Ltd.

Hiroaki Yoshino

Shinsuke Tei

Shinichi Akiyama

Kazumasa Sasakura

Nobuyuki Aoyagi

Yuki Sekine

This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part at the first bonding point; a second process (trajectory b) of moving the capillary horizontally at the pressure bonding height after execution of the first process to scarp off the column part by the capillary; and a third process (trajectory c-k) of repeating a pressing operation at least once after execution of the second process, the pressing operation involving moving the capillary forward and lowering the capillary temporarily during movement so that the capillary presses down on a wire portion positioned over the pressure bonded ball.

Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device

The semiconductor device manufacturing method includes a bonding step of bonding a wire to an electrode (), a looping wire formation step of looping the wire from the electrode () to a dummy electrode () to form a looping wire (), a pressing step of pressing a part of the wire, a moving step of moving the pressed part of the wire directly above the electrode, a wire separation step of separating the wire partially from a wire supply to form a pin wire () extending vertically upward from the electrode (), wherein the looping wire formation step adjusts the looping height of the wire to set the length of the looping wire to a predetermined length.

Semiconductor device manufacturing method

Provided is a method for manufacturing a semiconductor device which connects a first bond point and a second bond point by a wire. The method includes: a ball bonding step in which a crimping ball and a ball neck are formed at the first bond point by ball bonding; a thin-walled portion forming step in which a thin-walled portion having a reduced cross-sectional area is formed between the ball neck and the crimping ball; a wire tail separating step in which after a capillary is raised to unroll a wire tail, the capillary is moved in a direction to the second bond point, and the wire tail and the crimping ball are separated in the thin-walled portion; and a wire tail joining step in which the capillary is lowered and a side surface of the separated wire tail is joined onto the crimping ball.

Wire bonding apparatus and method for manufacturing semiconductor device

A wire bonding device for performing a wire bonding process includes: a bonding tool for inserting a wire; an ultrasonic vibrator; a drive mechanism for moving the bonding tool; and a control part. The control part performs: a bonding step of bonding the wire to a bonding point; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps including the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire.

Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording program

A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the discharge therebetween includes a current detection unit, a timer unit and a discharge determination unit. The current detection unit detects a discharge current flowing through the wire. The timer unit measures discharge detection time after application of the voltage before detection of the discharge current. The discharge determination unit determines whether or not the discharge is abnormal based on the discharge detection time. With this, a discharge examination device, a wire-bonding apparatus, and a discharge examination method that are capable of detecting abnormality of discharge are provided.

Discharge examination device, wire-bonding apparatus, and discharge examination method

Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus, a capillaryis lowered to a bonding position to bond an initial ballto a padon an overhanging die. Here, a position of the capillaryin a Z direction and a load detected by a load sensorare detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillaryat the load change point, a movement amount Z of the capillaryfrom the load changing position to the bonding position is calculated. After the capillaryis lifted by the movement amount Z, a wire loop is formed between the padand a lead

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of Hfrom a pointwhere the center of the capillary is positioned during second bonding on a leadto a point 'p', and then moved horizontally by a first distance of Ltoward a pad, and lowered to a point 'r'; a second folding step in which the tip end of the capillary is raised from the point &#x201c;r&#x201d; to a height of Hand then moved horizontally toward the leadby a second distance of L; and a third bonding step in which the center of the capillary is aligned with and then lowered to a pointon the leadadjacent to the point

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Tokyo, Japan

Hiroaki Yoshino