Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Hiroaki Yamashita

Syotaro Ono

Wataru Saito

Shunji Taniuchi

Toshiyuki Naka

Miho Watanabe

Hideyuki Ura

Hisao Ichijo

Hiroshi Ohta

Masaru Izumisawa

Masahiro Shimura

Hideto Sugawara

Shingo Sato

Toshio Nishida

Yuhki Fujino

Masakazu Shirakawa

Kiyoshi Urui

Takafumi Koumoto

According to one embodiment, a semiconductor device includes first and second electrodes, first, fourth, and sixth semiconductor regions of a first conductivity type, a junction region, a fifth semiconductor region of a second conductivity type, and a gate electrode. The junction region includes a second semiconductor region of the first conductivity type and a third second semiconductor region of the second conductivity type. The second semiconductor regions and the third semiconductor regions are alternately provided in a second direction perpendicular to a first direction. A concentration of at least one first element selected from the group consisting of a heavy metal element and a proton in the junction region is greater a concentration of the first element in the fourth semiconductor region, or a density of traps in the junction region is greater than that in the first semiconductor region and greater than that in the fourth semiconductor region.

Semiconductor device and method for manufacturing the same

A semiconductor device includes a semiconductor part including first to fifth layers; an electrode on a front surface of the semiconductor part; first and second control electrodes between the semiconductor part and the electrode. The first layer includes first and second portions alternately arranged along the front surface of the semiconductor part. The second layer is positioned between the first and second portions of the first layer. The first and second control electrodes are placed at boundaries of the first and second portions and the second layer, respectively. The third layer is provided between the second electrode and the first and second portions of the first layer. The fourth and fifth layers are selectively provided between the third layer and the second electrode. The first control electrode is opposed to the first, third and fourth layers. The second control electrode is opposed to the first, third and fifth layers.

Semiconductor device and method for controlling same

According to one embodiment, a semiconductor device includes first and second electrodes, first, second, third, fourth, fifth, sixth and seventh semiconductor regions, and a gate electrode. The first semiconductor region is provided on the first electrode. The second semiconductor region is provided on a portion of the first semiconductor region. The third semiconductor region is provided on another portion of the first semiconductor region. The fourth semiconductor region is provided in at least a portion between the first and third semiconductor regions. The fifth semiconductor region is provided between the first and fourth semiconductor regions. The sixth semiconductor region is provided on the third semiconductor region. The seventh semiconductor region is provided selectively on the sixth semiconductor region. The gate electrode opposes the second, sixth, and seventh semiconductor regions. The second electrode is provided on the sixth and seventh semiconductor regions.

Semiconductor device

A semiconductor device includes a semiconductor body, first and second electrodes, and a control electrode. The semiconductor body includes first to fourth semiconductor layers. The first electrode is provided on a front surface of the semiconductor body. The second electrode is provided on a back surface of the semiconductor body. The control electrode is provided between the semiconductor body and the first electrode. The second semiconductor layer is positioned between a portion and other portion of the first semiconductor layer in a first direction directed along the front surface. The third semiconductor layer contacts the portion of first semiconductor layer and the second semiconductor layer. The third semiconductor layer includes a first end portion positioned in the portion of the first semiconductor layer and a second end portion positioned in the second semiconductor layer. The fourth semiconductor layer is selectively provided in the second end portion.

A semiconductor device includes a semiconductor body, first to third electrodes provided on the semiconductor body, and a control electrode. The control electrode is provided between the semiconductor body and the first electrode. The semiconductor body includes first to sixth layers. The second layer of a second conductivity type is selectively provided between the first layer of a first conductivity type and the first electrode. The third layer of the first conductivity type is selectively provided between the second layer and the first electrode. The fourth layer of the second conductivity type is provided between the first layer and the second and third electrodes. The fifth layer of the first conductivity type is selectively provided in the fourth layer and electrically connected to the first electrode. The sixth layer of the first conductivity type is provided in the fourth layer, and electrically connected to the third electrode.

A semiconductor device of an embodiment includes a semiconductor layer having a first plane and a second plane, a first semiconductor region of a first conductivity type, a second semiconductor region and a third semiconductor region of a second conductivity type, the first semiconductor region interposed between the third semiconductor region and the second semiconductor region, a first well region of a first conductivity type, a second well region of a first conductivity type separated from the first well region, a first contact region of a first conductivity type, a second contact region of a first conductivity type, a gate electrode provided on the first semiconductor region between the first well region and the second well region, a source electrode having a first region in contact with the first contact region and a second region in contact with the second contact region, and a drain electrode.

A semiconductor device includes a first conductivity type first semiconductor region, a second conductivity type second semiconductor region, a second conductivity type third semiconductor region, a first conductivity type fourth semiconductor region, a gate insulating portion, a gate electrode, and first and second electrodes. The first semiconductor region includes first and second portions. The second semiconductor region includes third and fourth portions. The gate electrode is on the gate insulating portion and over the first semiconductor region and a portion of the third semiconductor region. The first electrode is on, and electrically connected to, the fourth semiconductor region. The second electrode is over the first portion, the third portion, and the gate electrode, and spaced from the first electrode.

According to one embodiment, a semiconductor device includes a plurality of first semiconductor regions of a first conductivity type, a plurality of second semiconductor regions of a second conductivity type, a third semiconductor region of the second conductivity type, a fourth semiconductor region of the second conductivity type, a fifth semiconductor region of the first conductivity type, and a gate electrode. An impurity concentration of the second conductivity type of the third semiconductor region is higher than an impurity concentration of the second conductivity type of the second semiconductor regions. The fourth semiconductor region is provided on the first semiconductor regions. The gate electrode provided on the fourth semiconductor region with a gate insulation layer interposed. The gate electrode extends in a third direction. The third direction intersects the first direction. The third direction is parallel to a plane including the first direction and the second direction.

In general, according to one embodiment, a semiconductor device includes, a first semiconductor region, a plurality of second semiconductor regions, a plurality of third semiconductor regions, a fourth semiconductor region, a fifth semiconductor region, and a gate electrode. The third semiconductor region includes a first portion and a second portion. The first portion is provided between the second semiconductor regions adjacent to each other. An amount of impurity of the second conductivity type in the first portion is greater than an amount of impurity of the first conductivity type in the second semiconductor region contiguous to the first portion. The second portion is arranged with a part of the first semiconductor region. An amount of impurity of the second conductivity type in the second portion is smaller than an amount of impurity of the first conductivity type in the part of the first semiconductor region.

A semiconductor device according to an embodiment includes a first semiconductor layer of a first conductivity type, second semiconductor regions of a second conductivity type, a third semiconductor region of the second conductivity type, a fourth semiconductor region of the first conductivity type, a gate electrode, an insulating layer, and a first electrode. The first semiconductor layer includes first semiconductor regions. The second semiconductor regions are provided respectively between the first semiconductor regions. The insulating layer is provided between the gate electrode and the third semiconductor region. The first electrode includes a first portion and a second portion. The first portion is connected to the first semiconductor region. The second portion is provided on the fourth semiconductor region side of the first portion. The first electrode is provided on the first semiconductor region and on the second semiconductor region. The first electrode is provided around the fourth semiconductor region.

A first semiconductor device of an embodiment includes a first semiconductor layer of a first conductivity type, a first control electrode, an extraction electrode, a second control electrode, and a third control electrode. The first control electrode faces a second semiconductor layer of the first conductivity type, a third semiconductor layer of a second conductivity type, and a fourth semiconductor layer of a first conductivity type, via a first insulating film. The second control electrode and the third control electrode are electrically connected to the extraction electrode, and face the second semiconductor layer under the extraction electrode, via the second insulating film. At least a part of the second control electrode and the whole of the third control electrode are provided under the extraction electrode. The electrical resistance of the second control electrode is higher than the electrical resistance of the third control electrode.

A semiconductor device comprising: a Metal Oxide Semiconductor Field Effect Transistor including: a semiconductor substrate including a first semiconductor layer of a first conductivity type; second semiconductor layers of a second conductivity type extending in a depth direction from one surface of the semiconductor substrate, and having space each other; a first diode including a fifth semiconductor layer of the second conductivity type contacting the second semiconductor layer in one surface side of the semiconductor substrate, the first semiconductor layer and the second semiconductor layers; and an anode of the second diode connected to an anode of the first diode.

A semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type provided in the first semiconductor region, an element region, and a termination region. The element region includes a third semiconductor region of the second conductivity type, a fourth semiconductor region of the first conductivity type, and a gate electrode disposed on a gate insulating layer that extends adjacent the third semiconductor region and the fourth semiconductor region. The termination region surrounds the element region and includes a first electrode, which includes first portions extending in a first direction and second portions extending in a second direction. A plurality of first electrodes are provided on the first semiconductor region and the second semiconductor region. An interval between adjacent first portions in the second direction is less than an interval between adjacent second portions in the first direction.

A semiconductor device includes a first layer of a first conductivity type between a first and a second electrode. A second layer of the first conductivity type is between the first layer and the second electrode. A pair of third layers of a second conductivity type has a first portion in the first layer and a second portion contacting the second layer. A fourth layer is between the second layer and the second electrode and between the third layers and the second electrode. A fifth layer is between the fourth layer and the second electrode. A third electrode is adjacent to the second layer via a first insulating film. A fourth electrode is between the second electrode and the third electrode and adjacent to the fourth semiconductor layer via a second insulating film. The second insulating film is thinner than the first insulating film.

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Hyogo-ken, Japan

Hiroaki Yamashita