Nichia Corporation

Hiroaki Ukawa

Ryuichi Nakagami

Yusuke Hayashi

Ryuji Muranaka

Ryo Iwasa

Ikuya Nii

Saiki Yamamoto

Atsushi Bando

Toshimasa Takao

Nobuhide Kasae

Daigo Hiraoka

Shinichi Ichikawa

A light emitting device includes: a base member including: a first lead, a second lead, and resin member supporting the first lead and the second lead, wherein each of a surface of the first lead that includes a first surface, a surface of the second lead, and a surface of the resin member that includes a second surface are positioned at an upper surface of the base member; a light emitting element located at the surface of the first lead; a resin frame located at the upper surface of the base member, where the first surface and at least a portion of the second surface are exposed inward of the resin frame; and a reflective member covering at least a portion of the second surface. Projections are located on the upper surface of the resin member that forms a portion of the upper surface of the base member.

Light emitting device

A light-emitting device includes: a base member including: a first lead, a second lead, and a securing member securing the first and second leads; a light-emitting element mounted on an upper surface of the base member; a frame, a part of which is disposed on the upper surface of the base member to surround the light-emitting element; a first member covering at least a portion of an upper surface of the securing member that is exposed at an outer peripheral side of the frame in a top view, the first member being arranged intermittently under the frame and containing a reflective material; and a second member covering the light-emitting element, the frame, and the first member. The frame has a first region on which the first member is arranged and a second region on which the first member is not arranged, the first and second regions having different heights.

Light-emitting device and method of manufacturing the same

A light-emitting device includes: a base member; a base body formed on an upper surface of the base member, the base body including a wiring layer; a light-emitting element mounted on an upper surface of the base body, wherein the light-emitting element includes an element-substrate, and a semiconductor layer located on the element-substrate; a resin frame located on the upper surface of the base body; and a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of inner side surface of the resin frame, and the upper surface of the base body. The first resin includes: a reflective material layer that contains a reflective material, and a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material.

Light-emitting device

A light emitting device includes: a base member including: a first lead, a second lead, and a supporting member holding the first lead and the second lead while electrically separating the first lead and the second lead from each other; a light emitting element located on the first lead; a resin frame located on the upper surface of the base member; a first resin part surrounded by the resin frame and covering the light emitting element; and a second resin part covering the resin frame and the first resin part. The first lead includes a main part having a plurality of projecting parts disposed at a lateral surface between an upper surface and a lower surface of the main part. The plurality of projecting parts overlap with the resin frame in a plan view.

A light-emitting device includes a base member including a first lead, a second lead, and a securing member securing the first lead and the second lead, a light-emitting element mounted on an upper surface of the base member, a frame disposed on the upper surface of the base member to surround the light-emitting element, a first member covering at least a portion of an upper surface of the securing member exposed at an outer peripheral side of the frame in a top view, the first member being in contact with an outer lateral surface of the frame and containing a reflective material, and a second member covering the light-emitting element, the frame, and the first member. The first member has an inclined region in a cross-sectional view. A maximum height of the inclined region is less than a height of an upper end of the frame.

A light emitting device includes: a base comprising a first lead, a second lead, and a supporting member; a light emitting element mounted on the first lead; a protection element mounted on the second lead; a wire including a first end and a second end, wherein the first end is connected to an upper surface of the first lead, and the second end is connected to a first terminal electrode of the protection element; a resin frame located on an upper surface of the base, wherein the resin frame covers at least part of the protection element and surrounds the light emitting element and the first end of the wire; a first resin member surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin member covering the resin frame and the first resin member.

Light emitting device and method of manufacturing the light emitting device

A light-emitting device includes: a light-emitting element; a base including a first lead having an element disposal portion and a first wire bonding portion, a second lead having a second wire bonding portion and a fixing member; a frame provided on a upper surface of the base; an Ag plating layer covering an upper surface of the element disposal portion; an Au plating layer covering at least an upper surface of the first wire bonding portion and at least an upper surface of the second wire bonding portion; a first wire; and a second wire. The Ag plating layer is disposed apart inwardly from at least a part of an outer circumference of an end portion of the element disposal portion, and the frame body is provided at a position that the frame body covers the Ag plating layer, the first wire bonding portion, and the second wire bonding portion.

Light-emitting device and method for manufacturing the same

A light-emitting device includes: a base body comprising a resin member, a first lead, and a second lead, wherein the first lead and the second lead are supported by the resin member; a light-emitting element mounted on an upper surface of the base body; a resin frame located on the upper surface of the base body, surrounding the light-emitting element; and a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of an inner side surface of the resin frame, and the upper surface of the base body, wherein the first resin includes: a reflection material layer that contains a reflection material, and a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material.

Light-emitting device and manufacturing method thereof

A light-emitting device includes: a first light source including a first light-emitting element having a peak emission wavelength in a range of 430 nm to 480 nm; a second light source including a second light-emitting element having a peak emission wavelength in a range of 430 nm to 480 nm; a third light source; and an encapsulant containing a phosphor. In a 1931 CIE chromaticity diagram, the light-emitting device has: a first chromaticity point when only the first light source is operated, a second chromaticity point different from the first chromaticity point when only the second light source is operated, and a third chromaticity point when only the third light source is operated, the third chromaticity point having a y-value larger than a y-value on a straight line passing the first chromaticity point and the second chromaticity point.

A light emitting device includes: a base member including: a first lead, a second lead, and a resin member supporting the first lead and the second lead, wherein each of a surface of the first lead that includes a first surface, a surface of the second lead, and a surface of the resin member that includes a second surface are positioned at an upper surface of the base member; a light emitting element located at the surface of the first lead that forms a portion of the upper surface of the base member; a resin frame located at the upper surface of the base member so as to surround the light emitting element, and configured such that the first surface and at least a portion of the second surface are exposed inward of the resin frame; and a reflective member covering at least a portion of the second surface.

A light emitting device includes a plurality of light emitting elements and a package. The package includes two metal parts on which the plurality of light emitting elements are disposed, and a resin body securing the two metal parts. The resin body has four sides and four connecting parts alternately connected to one another in a top view. Two subsequent sides are perpendicular to each other. Each of the two metal parts includes a die-pad on which one or more of the plurality of light emitting elements are disposed, and two extending portions extending from the die-pad. An end portion of each of the two extending portions is extended laterally outward from a respective one of the connecting parts of the resin body, and the end portion of each of the two extending portions is located inward of virtual extension lines of corresponding two sides of the resin body.

A light-emitting device includes a light-emitting element with a peak emission wavelength in a range of 400 nm to 410 nm and a fluorescent member that contains a first phosphor with a peak emission wavelength in a range of 440 nm to 470 nm containing a Eu-activated alkaline-earth phosphate that contains Cl in a composition, a second phosphor with a peak emission wavelength in a range of 500 nm to 530 nm containing a Eu-activated halogen-containing alkaline-earth silicate, a third phosphor with a peak emission wavelength in a range of 530 nm to 600 nm containing a Ce-activated rare-earth aluminate, and a fourth phosphor with a peak emission wavelength in a range of 600 nm to 660 nm containing a Eu-activated silicon nitride containing Al and at least one of Sr and Ca in a composition.

A light emitting device includes: a base member including: a first lead, a second lead, and a supporting member, the base member having an upper surface including a first surface, which is a surface of the first lead, a second surface, which is a surface of the second lead, and a third surface, which is a surface of the supporting member; a light emitting element located on the first surface; a protective element located on the second surface; a wire having a first end connected to the first surface, and a second end connected to a terminal electrode of the protective element; a resin frame located on the upper surface of the base member; a first resin part surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin part covering the resin frame and the first resin part.

A light emitting device includes one or more light emitting elements; a first lead on which the one or more light emitting elements are disposed; a second lead electrically connected to the one or more light emitting elements; a resin member supporting the first lead and the second lead, and including one or more projected portions; and a resin frame surrounding the light emitting elements, and covering at least a portion of each of the projected portions.

Growing community of inventors

Itano-gun, Japan

Hiroaki Ukawa