Fanuc Corporation

Hiroaki Tokito

Kazuhiro Suzuki

Etsuo Yamazaki

Akira Egawa

Takeshi Mochida

A laser cutting device includes a laser oscillator, a cutting nozzle configured to irradiate a work with laser light so as to cut the work, and a controller configured to control the laser oscillator and a drive unit configured to move the cutting nozzle. The controller includes a laser output control unit, a diagnosis performance determination unit configured to determine, when the laser oscillator satisfies a predetermined operation condition, based on a cutting program, whether or not the laser oscillator is diagnosed, and a diagnosis function performance unit configured to issue a laser output command for diagnosis of the laser oscillator to the laser oscillator. When the diagnosis performance determination unit determines that the laser oscillator is diagnosed, the diagnosis performance determination unit outputs the laser output command for diagnosis to the laser oscillator.

Laser cutting device, method of diagnosing laser oscillator and computer-readable recording medium

A laser processing apparatus including a processing nozzle for irradiating a workpiece with laser beam, a driving mechanism for relatively moving the processing nozzle and the workpiece, and a gap sensor for detecting a gap between the processing nozzle and the workpiece. The apparatus includes a gap control section referring to a measured value detected by the gap sensor and calculating a manipulating variable used for controlling the driving mechanism so as to maintain the gap during execution of laser processing at a first dimension, a power monitoring section monitoring electric power from a power supply and sending an abnormality detection signal to the gap control section when a power abnormality occurs, and a control action switching section switching a control action of the gap control section so as to increase the gap from the first dimension when the abnormality detection signal is sent to the gap control section.

Laser processing apparatus capable of retracting processing nozzle upon power failure

A laser processing apparatus including a processing nozzle for irradiating a workpiece with laser beam; an actuator for moving the processing nozzle relative to the workpiece; a distance detector for detecting a gap between the processing nozzle and the workpiece; a power abnormality detecting section for detecting an abnormality in electric power supplied from a power supply unit; a gap control section for controlling the actuator based on a detected value obtained by the distance detector, so as to perform a gap control for adjusting the gap to a target value, during execution of laser processing; and a change control section for maintaining the gap control in an enabled state until a power abnormality is detected by the power abnormality detecting section during execution of laser processing, and for disabling the gap control when a power abnormality is detected by the power abnormality detecting section during execution of laser processing.

Laser processing apparatus capable of retracting processing nozzle upon detection of power outage

A laser processing device having a function for avoiding interference during an approach motion of a processing nozzle of the laser processing device. When a distance between a processing nozzle and a workpiece is equal to a setting value where gap control can be started, it is judged as to whether or not the mechanical position of the processing nozzle is above a predetermined processing start position. When the mechanical position of the processing nozzle is higher than the processing start position, a controller judges that an abnormality occurs by which laser processing cannot be carried out, and automatically stops the approach motion of the processing nozzle.

Laser processing device having function for avoiding interference at the time of nozzle approach

A control apparatus for a laser oscillator includes an abnormality determining unit which determines an abnormality of a first assembly based on a first deviation between a first laser beam output command and a first laser beam output and which determines an abnormality of a second assembly based on a second deviation between a second laser beam output command and a second laser beam output, a command unit for issuing a predetermined current command to at least one of a first power unit and a second power unit when the abnormality determining unit determines that at least one of the first assembly and the second assembly has an abnormality, and an abnormality determination stopping unit for stopping the abnormality determining unit from determining an abnormality when the predetermined current command is issued.

Control apparatus for controlling laser oscillator

A controller () for controlling a process nozzle () and a laser oscillator () includes: an analyzer (); a calculator () for calculating angle of a virtual corner part formed by two main process paths; a determining unit () for determining whether distance between the two main process paths corresponding to the circular-arc process path(s) is smaller than a first predetermined value, and determining whether the calculated angle is smaller than a second predetermined value; and a changing unit () for changing a laser process condition in the circular-arc process path(s) from a laser process condition in the main process paths when it is determined that the linear distance is smaller than the first predetermined value and the angle is smaller than the second predetermined value.

Controller for processing corner part in process path

A laser-machining device () for machining a workpiece (W) by radiating it with the laser beam output from a nozzle () of a laser oscillator () is disclosed. A gap amount sensor () detects the gap amount between the workpiece and the nozzle. An approach unit () causes the nozzle to approach the workpiece to a position suitable for the laser machining. The approach unit performs a first approach operation () for making the nozzle approach the workpiece using the gap amount detected by the gap amount sensor until the gap amount comes to assume a predetermined value, and a second approach operation (), after the first approach operation, for causing the nozzle to approach the workpiece until the complete approach without using the gap amount detected by the gap amount sensor. As a result, the required time is shorter and a stable piercing process can be executed.

Laser-machining device

An apparatus and a method for laser machining with a gap or tracing control, capable of shortening time required for moving a machining head from a machining end point of one machining shape to a machining start point of next machining shape. The laser machining is performed with the gap or tracing control in which a gap amount between the machining nozzle and the workpiece is controlled to be constant. Driving of a Z-axis is started at a predetermined velocity when the machining nozzle reaches a machining end point of one machining shape. In the drive of the Z-axis, when the Z-axis is driven by a predetermined amount, driving of an X-axis and a Y-axis is started so that the machining nozzle moves to the next machining start point by rapid traverse. A direction of driving of the Z-axis is reversed at a middle point between the machining end point and the machining start point. The driving of the Z-axis may be discontinued at a retreated point. When the gap amount reaches a predetermined amount, the gap control is started. A length of the motion path from the machining end point to the machining start point is made shorter and frequency of stopping/switching operation of the gap control axis and the machining feed axes is reduced to shorten a time required for the transition to the machining start point of the next machining shape.

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Yamanashi, Japan

Hiroaki Tokito