Mitsumi Electric Company Ltd.

Hiroaki Tobitsuka

Koichi Hosoya

Satoshi Ajiki

A plurality of magnetoresistive heads are arranged on a wafer substrate. A plurality of electrode pads are arranged on the wafer substrate in a first direction. Each electrode pad is connected to an associated magnetoresistive head. Respective adjacent electrode pads are shifted from each other in a second direction perpendicular to the first direction. The shifted amount of the adjacent pads in the second direction is larger than a dimension of the electrode pad in the second direction.

Multi-channel magnetoresistive head device

A plurality of magnetic head elements, each having a terminal portion, are arranged on a first face of the head chip. A wiring board member is electrically connected to the respective terminal portions of the magnetic head elements. A pair of side chips sandwich the head chip from both sides of the first face. Each of the side chips has faces forming a recessed portion which faces with at least the terminal portions of the magnetic head elements.

Growing community of inventors

Yamagata, Japan

Hiroaki Tobitsuka