Shin-etsu Chemical Co., Ltd.

Denso Corporation

Shin-etsu Polymer Co., Ltd.

Hiroaki Tetsuka

Kunihiro Yamada

Akihiro Endo

Tsutomu Yoneyama

Mamoru Hagiwara

Manabu Maeda

Chihiro Hayakawa

Kunihiko Mita

Akio Nakano

Hiroaki Kizaki

Yasuo Wakatsuki

Yoshinori Yoneda

Yoshitaka Aoki

Katsunori Iwase

Yoshinobu Suzuki

Takehiro Kurata

Jyunya Ishida

As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.

Air conditioning system

A method for preparing a cyclic olefin addition polymer of high gas permeability, which method including subjecting a specific type of cyclic olefin-functional siloxane and a mixture thereof with a specific type of cyclic olefin compound to addition polymerization in the presence of a multi-component catalyst containing (A) a zero-valent palladium compound, (B) an ionic boron compound, and (C) a phosphine compound having a substituent group selected from an alkyl group having 3 to 6 carbon atoms, a cycloalkyl group and an aryl group, to obtain a cyclic olefin addition polymer of high gas permeability wherein a ratio of the structural units derived from the cyclic olefin-functional siloxane is at 10 to 100 mole % of the addition polymer and a number average molecular weight (Mn) ranges from 100,000 to 2,000,000.

Method for preparing cyclic olefin addition polymer of high gas permeability

A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, RSiO(Ris one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8&#x2266;a&#x2266;2.2) having a dynamic viscosity at 25&#xb0; C. of 50 mm/s to 500,000 mm/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m&#xb7;K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).

Heat-dissipating silicone grease composition

Provided is a curable organopolysiloxane composition which includes (A) an organopolysiloxane containing at least 2 alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) gallium and/or an alloy thereof, with a melting point within a range from 0 to 70&#xb0; C., optionally (D) a heat conductive filler with an average particle size within a range from 0.1 to 100 &#x3bc;m, (E) a platinum based catalyst, and (F) an addition reaction control agent. The composition is useful as a material capable of forming a layer with excellent thermal conductivity that is sandwiched between a heat generating electronic component and a heat radiating member.

Curable organopolysiloxane composition and semiconductor device

A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &#x3bc;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &#x3bc;m. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250&#xb0; C. and a particle diameter of 0.1-100 &#x3bc;m, together with a thermally-conducting powder (2) having a melting temperature exceeding 250&#xb0; C. and an average particle diameter of 0.1-100 &#x3bc;m, such that (1)/[(1)+(2)]=0.2-1.0.

Heat-dissipating member, manufacturing method and installation method

The present invention relates to a thermoconducting silicone composition having a viscosity at 25&#xb0; C. before curing of 10-1,000 Pa&#xb7;s, a method of installing the composition, and a heat dissipating structure comprising the silicone composition.

Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same

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Gunma, Japan

Hiroaki Tetsuka