Ricoh Company, Ltd.

Hiroaki Teratani

Tetsuya Okada

Koichi Sogawa

Akinori Suzuki

Tadao Uehara

Tohru Haruki

Masanori Miyata

Kenji Nishihara

Yuuichi Kohno

Shisyo Chin

Taro Usami

A chemical mechanical polishing method including a step of forming a plurality of interlayer insulating films so as to coat a plurality of projecting patterns, at least one of the plurality of projecting patterns being formed on each of a plurality of substrates, whereby the plurality of projection patterns have different area ratios R with respect to the corresponding substrates, and performing a flattening process on the interlayer insulating films before linear approximation; a step of obtaining a linear approximation formula R=aT+b expressing a relationship between the area ratio R and a polishing time T, where R, R, R, . . . , Rx represent the area ratio R of each of the projecting patterns with respect to the corresponding substrates, and T, T, T, . . . , Tx represent the polishing time T required for achieving a target film thickness when performing the flattening process by polishing each of the interlayer insulating films coating the projecting patterns; and a step of calculating, with the use of a formula T=(R&#x2212;b)/a, the polishing time T for the interlayer insulating films coating the projecting patterns having the area ratio R.

Chemical mechanical polishing method and chemical mechanical polishing device

Growing community of inventors

Hyogo, Japan

Hiroaki Teratani