Rohm Co., Ltd.

Hiroaki Takuma

Satoshi Uchida

Katsuhiko Ikawa

The present invention provides a sub-mount type device for emitting light which has high speed response and yet can radiate heat sufficiently. The sub-mount type device for emitting light comprises a heat sink (4), a sub-mount body (62) mounted on the heat sink (4) which comprises an insulating layer (38) with a upper face and a lower face, a upper electrode (42) on the upper face and a lower electrode 44 and 36 on the lower face, the insulating layer having two parts of the insulating layer (38) thickness of which is different, and a chip (30) for emitting light above the thinner part (39) of the insulating layer (38).

Sub-mount type device for emitting light

The present invention provides a semiconductor device wherein a semiconductor chip is fixed on a mount body without a short circuit. A positive electrode (42) is provided above a conductive substrate through an insulating layer (38). The electrode (42) have a concavity (43). A bonding connector consists a first bonding connector (70) on the electrode (42) and a second bonding connector (71) around the first bonding connector (70), the first bonding connector being more fluid than the second bonding connector at a certain temperature. A LASER chip (30) is fixed on the second bonding connector (71).

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Kyoto, Japan

Hiroaki Takuma